The Global 3D IC and 2.5D IC Packaging Market size is expected to reach $83 billion by 2029, rising at a market growth of 10.1% CAGR during the forecast period.
The logic segment is the growing application of 3D IC and 2.5D IC Packaging due to the expansion of smart city projects worldwide, growing safety concerns, and rising demand for improved high-level access control systems. For example, the Indian government invested a large amount of money to create 100 smart cities from existing ones. The United States government also pledged to invest in technology for smart cities in 2016. It is therefore expected that smart city projects will aid in the growth of the IoT industry in these locations. The creation and application of technology for smart cities can benefit greatly from using 3D IC packaging. These systems and devices can be made smaller, more powerful, and energy-efficient by utilizing 3D IC packaging. Some of the factors impacting the market are increasing demand for gaming devices and consumer electronics, growing industry-wide use of semiconductor devices, and higher level of integration-related thermal problems along with reliability challenges.
E-book readers, tablet computers, gaming devices, 3D smart glass, virtual reality, and augmented reality goods are just a few examples of the many new types of consumer electronics that are becoming available on the market due to recent developments in technology. Therefore, the rapidly increasing demand for these ICs is aiding in expanding the market throughout the forecast period. Advanced semiconductor devices are required to offer a variety of new capabilities due to rising digitization, expanding patterns of remote operations, and remote work. Therefore, all these elements are developing the market. However, High-density multi-level assembly per unit footprint is offered by 3D IC. This is appealing for numerous applications where downsizing is required, but it also poses problems for thermal management because increasing integration raises the on-chip temperature. Hence, all these elements may lead to slowed market growth.
By end user, the market is divided into consumer electronics, industrial, telecommunications, automotive, military & aerospace, medical devices, and others. The telecommunications segment procured a remarkable growth rate in the market in 2022. 3D ICs and 2.5D ICs offer significant benefits for telecommunications applications, including higher performance, lower power consumption, space savings, improved thermal performance, and better signal integrity. These advantages make them an attractive option for telecommunication device designers and manufacturers. 3D IC and 2.5D IC packaging enable the integration of multiple components in a smaller form factor, making them ideal for applications where space is limited, such as in mobile devices.
Based on packaging technology, the market is characterized into 3D wafer-level chip-scale packaging (WLCSP), 3D through-silicon via (TSV), and 2.5D. The 3D wafer-level chip-scale packaging (WLCSP) segment procured a considerable growth rate in the market in 2022. 3D WLCSP is one of the most compact package options, offering greater functionality and better thermal performance in most PCBs or printed circuit boards. Using polymers that can withstand high temperatures, 3D WLCSP offers a simplified process architecture for producing 3D ICs, overcoming the thermal issue.
On the basis of application, the market is classified into logic, imaging & optoelectronics, memory, MEMS/Sensors, LED, and others. The MEMS/sensors segment recorded a significant revenue share in the market in 2022. Microactuators, microsensors, and microelectronics are the functional parts of MEMS. Among other things, MEMS' cutting-edge components include gyroscopes, digital compasses, accelerometers, inertial modules, humidity sensors, microphones, pressure sensors, and smart sensors. All of these components and sensors must have a structure that has been reduced in size.
The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Acquisitions, and Partnerships & Collaborations.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.
| Report Attribute | Details |
|---|---|
| Market size value in 2022 | USD 42.8 Billion |
| Market size forecast in 2029 | USD 83 Billion |
| Base Year | 2022 |
| Historical Period | 2019 to 2021 |
| Forecast Period | 2023 to 2029 |
| Revenue Growth Rate | CAGR of 10.1% from 2023 to 2029 |
| Number of Pages | 262 |
| Number of Table | 410 |
| Report coverage | Market Trends, Revenue Estimation and Forecast, Segmentation Analysis, Regional and Country Breakdown, Market Share Analysis, Companies Strategic Developments, Company Profiling |
| Segments covered | Packaging Technology, Application, End User, Region |
| Country scope | US, Canada, Mexico, Germany, UK, France, Russia, Spain, Italy, China, Japan, India, South Korea, Singapore, Taiwan, Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria |
| Growth Drivers |
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| Restraints |
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Region wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment recorded the highest revenue share in the market in 2022. Due to its wide range of consumer electronics uses, the Asia Pacific region is among the major markets. This is mostly due to the region's dense population, which makes it the four primary region with the highest potential market. Additionally, advancements and expansion of telecommunication and automotive sectors are also increasingly using ICs.
Free Valuable Insights: Global 3D IC and 2.5D IC Packaging Market size to reach USD 83 Billion by 2029
By Packaging Technology
By End User
By Application
By Geography
The Market size is projected to reach USD 83 billion by 2029.
Growing industry-wide use of semiconductor devices are driving the Market in coming years, however, Higher level of integration-related thermal problems along with reliability challenges restraints the growth of the Market.
Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.
The 2.5D segment acquired maximum revenue share in the Market by Packaging Technology in 2022 thereby, achieving a market value of $42.6 billion by 2029.
The Memory segment is leading the Market by Application in 2022 thereby, achieving a market value of $22.8 billion by 2029.
The Asia Pacific market dominated the Global 3D IC and 2.5D IC Packaging Market by Region in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $35.7 billion by 2029.
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