Asia Pacific 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Country and Growth Forecast, 2023 - 2029

The Asia Pacific 3D IC and 2.5D IC Packaging Market would witness market growth of 10.4% CAGR during the forecast period (2023-2029).

3D and 2.5D ICs have lately become well-liked as suitable chipset integration platforms due to their advantages in achieving extraordinarily high package density as well as excellent energy efficiency. Data center networking, autonomous vehicles, and high-performance computing are driving the market under consideration's technological development, which is influencing implementation statistics. At the device, edge computing, and cloud levels, massive computational resources are at present in demand.

The development of advanced items rises as the range of market competitors does. Companies are beginning to include 3D IC and 2.5D IC in various programmable logic to provide operational efficiency with additional convenience and increased productivity. In-field programming gate arrays, for instance, are a market leader for Intel Corp. Additionally, there is a considerable need for 2.5D and 3D IC packaging technology in the expanding consumer electronics industry, particularly for cellphones and tablets. The computing burden has changed significantly during the last few decades. Previously a back-end process and a hassle, packaging technology is now being prioritized for innovation and is essential to the cost, function, and performance of products.

China intends to extend its 5G mobile network by having 2.64 million base stations by the end of 2023, as stated by the Ministry of Industry and Information Technology (MIIT). By the end of March, the 5G base stations will be able to accommodate all 620 million 5G cellphone customers in the country. In addition, Chinese manufacturers will need more 2.5D IC and 3D IC semiconductor packaging due to the region's expanding 5G deployment, which is also anticipated to boost demand for 5G-enabled gadgets. Likewise, according to the China Academy of Information and Communications Technology (CAICT), the nation's shipments of cell phones compatible with 5G networks rose sharply in 2021.

The China market dominated the Asia Pacific 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $10,074.5 Million by 2029. The Japan market is experiencing a CAGR of 9.7% during (2023 - 2029). Additionally, The Taiwan market would showcase a CAGR of 11.1% during (2023 - 2029).

Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into China, Japan, Taiwan, India, South Korea, Singapore and Rest of Asia Pacific.

Free Valuable Insights: The Worldwide 3D IC and 2.5D IC Packaging Market is Projected to reach USD 83 Billion by 2029, at a CAGR of 10.1%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.

Scope of the Study

Market Segments Covered in the Report:

By Packaging Technology

• 2.5D
• 3D wafer-level chip-scale packaging (WLCSP)
• 3D Through-silicon via (TSV)

By End User

• Consumer Electronics
• Automotive
• Industrial
• Military & Aerospace
• Telecommunications
• Medical Devices & Others

By Application

• Memory
• Imaging & Optoelectronics
• MEMS/Sensors
• Logic
• LED
• Others

By Country

• China
• Japan
• India
• South Korea
• Singapore
• Taiwan
• Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company Limited
• Intel Corporation
• ASE Group (ASE Technology Holding Co., Ltd.)
• Amkor Technology, Inc.
• Broadcom, Inc.
• Texas Instruments, Inc.
• JCET Group
• Powertech Technology, Inc.
• United Microelectronics Corporation

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific 3D IC and 2.5D IC Packaging Market, by Packaging Technology
1.4.2 Asia Pacific 3D IC and 2.5D IC Packaging Market, by End User
1.4.3 Asia Pacific 3D IC and 2.5D IC Packaging Market, by Application
1.4.4 Asia Pacific 3D IC and 2.5D IC Packaging Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis – Global
3.1 Market Share Analysis, 2022

Chapter 4. Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology
4.1 Asia Pacific 2.5D Market by Country
4.2 Asia Pacific 3D wafer-level chip-scale packaging (WLCSP) Market by Country
4.3 Asia Pacific 3D Through-silicon via (TSV) Market by Country

Chapter 5. Asia Pacific 3D IC and 2.5D IC Packaging Market by End User
5.1 Asia Pacific Consumer Electronics Market by Country
5.2 Asia Pacific Automotive Market by Country
5.3 Asia Pacific Industrial Market by Country
5.4 Asia Pacific Military & Aerospace Market by Country
5.5 Asia Pacific Telecommunications Market by Country
5.6 Asia Pacific Medical Devices & Others Market by Country

Chapter 6. Asia Pacific 3D IC and 2.5D IC Packaging Market by Application
6.1 Asia Pacific Memory Market by Country
6.2 Asia Pacific Imaging & Optoelectronics Market by Country
6.3 Asia Pacific MEMS/Sensors Market by Country
6.4 Asia Pacific Logic Market by Country
6.5 Asia Pacific LED Market by Country
6.6 Asia Pacific Others Market by Country

Chapter 7. Asia Pacific 3D IC and 2.5D IC Packaging Market by Country
7.1 China 3D IC and 2.5D IC Packaging Market
7.1.1 China 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.2 China 3D IC and 2.5D IC Packaging Market by End User
7.1.3 China 3D IC and 2.5D IC Packaging Market by Application
7.2 Japan 3D IC and 2.5D IC Packaging Market
7.2.1 Japan 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.2 Japan 3D IC and 2.5D IC Packaging Market by End User
7.2.3 Japan 3D IC and 2.5D IC Packaging Market by Application
7.3 Taiwan 3D IC and 2.5D IC Packaging Market
7.3.1 Taiwan 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.2 Taiwan 3D IC and 2.5D IC Packaging Market by End User
7.3.3 Taiwan 3D IC and 2.5D IC Packaging Market by Application
7.4 India 3D IC and 2.5D IC Packaging Market
7.4.1 India 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.2 India 3D IC and 2.5D IC Packaging Market by End User
7.4.3 India 3D IC and 2.5D IC Packaging Market by Application
7.5 South Korea 3D IC and 2.5D IC Packaging Market
7.5.1 South Korea 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.5.2 South Korea 3D IC and 2.5D IC Packaging Market by End User
7.5.3 South Korea 3D IC and 2.5D IC Packaging Market by Application
7.6 Singapore 3D IC and 2.5D IC Packaging Market
7.6.1 Singapore 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.6.2 Singapore 3D IC and 2.5D IC Packaging Market by End User
7.6.3 Singapore 3D IC and 2.5D IC Packaging Market by Application
7.7 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market
7.7.1 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.7.2 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by End User
7.7.3 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Application

Chapter 8. Company Profiles
8.1 Samsung Electronics Co., Ltd. (Samsung Group)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.6 SWOT Analysis
8.2 Taiwan Semiconductor Manufacturing Company Limited
8.2.1 Company overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expenses
8.3 Intel Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expenses
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding Co., Ltd.)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Research & Development Expense
8.5.4 Recent strategies and developments:
8.5.4.1 Partnerships, Collaborations, and Agreements:
8.6 Broadcom, Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 SWOT Analysis
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. United Microelectronics Corporation
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Regional Analysis
8.10.4 Research & Development Expenses

TABLE 1 Asia Pacific 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 2 Asia Pacific 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 3 Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 4 Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 5 Asia Pacific 2.5D Market by Country, 2019 - 2022, USD Million
TABLE 6 Asia Pacific 2.5D Market by Country, 2023 - 2029, USD Million
TABLE 7 Asia Pacific 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2019 - 2022, USD Million
TABLE 8 Asia Pacific 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2023 - 2029, USD Million
TABLE 9 Asia Pacific 3D Through-silicon via (TSV) Market by Country, 2019 - 2022, USD Million
TABLE 10 Asia Pacific 3D Through-silicon via (TSV) Market by Country, 2023 - 2029, USD Million
TABLE 11 Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 12 Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 13 Asia Pacific Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 14 Asia Pacific Consumer Electronics Market by Country, 2023 - 2029, USD Million
TABLE 15 Asia Pacific Automotive Market by Country, 2019 - 2022, USD Million
TABLE 16 Asia Pacific Automotive Market by Country, 2023 - 2029, USD Million
TABLE 17 Asia Pacific Industrial Market by Country, 2019 - 2022, USD Million
TABLE 18 Asia Pacific Industrial Market by Country, 2023 - 2029, USD Million
TABLE 19 Asia Pacific Military & Aerospace Market by Country, 2019 - 2022, USD Million
TABLE 20 Asia Pacific Military & Aerospace Market by Country, 2023 - 2029, USD Million
TABLE 21 Asia Pacific Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 22 Asia Pacific Telecommunications Market by Country, 2023 - 2029, USD Million
TABLE 23 Asia Pacific Medical Devices & Others Market by Country, 2019 - 2022, USD Million
TABLE 24 Asia Pacific Medical Devices & Others Market by Country, 2023 - 2029, USD Million
TABLE 25 Asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 26 Asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 27 Asia Pacific Memory Market by Country, 2019 - 2022, USD Million
TABLE 28 Asia Pacific Memory Market by Country, 2023 - 2029, USD Million
TABLE 29 Asia Pacific Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 30 Asia Pacific Imaging & Optoelectronics Market by Country, 2023 - 2029, USD Million
TABLE 31 Asia Pacific MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 32 Asia Pacific MEMS/Sensors Market by Country, 2023 - 2029, USD Million
TABLE 33 Asia Pacific Logic Market by Country, 2019 - 2022, USD Million
TABLE 34 Asia Pacific Logic Market by Country, 2023 - 2029, USD Million
TABLE 35 Asia Pacific LED Market by Country, 2019 - 2022, USD Million
TABLE 36 Asia Pacific LED Market by Country, 2023 - 2029, USD Million
TABLE 37 Asia Pacific Others Market by Country, 2019 - 2022, USD Million
TABLE 38 Asia Pacific Others Market by Country, 2023 - 2029, USD Million
TABLE 39 Asia Pacific 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2022, USD Million
TABLE 40 Asia Pacific 3D IC and 2.5D IC Packaging Market by Country, 2023 - 2029, USD Million
TABLE 41 China 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 42 China 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 43 China 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 44 China 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 45 China 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 46 China 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 47 China 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 48 China 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 49 Japan 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 50 Japan 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 51 Japan 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 52 Japan 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 53 Japan 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 54 Japan 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 55 Japan 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 56 Japan 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 57 Taiwan 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 58 Taiwan 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 59 Taiwan 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 60 Taiwan 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 61 Taiwan 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 62 Taiwan 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 63 Taiwan 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 64 Taiwan 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 65 India 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 66 India 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 67 India 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 68 India 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 69 India 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 70 India 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 71 India 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 72 India 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 73 South Korea 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 74 South Korea 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 75 South Korea 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 76 South Korea 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 77 South Korea 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 78 South Korea 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 79 South Korea 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 80 South Korea 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 81 Singapore 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 82 Singapore 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 83 Singapore 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 84 Singapore 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 85 Singapore 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 86 Singapore 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 87 Singapore 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 88 Singapore 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 89 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 90 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 91 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 92 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 93 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 94 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 95 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 96 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 97 Key Information – Samsung Electronics Co., Ltd.
TABLE 98 Key Information– Taiwan Semiconductor Manufacturing Company Limited
TABLE 99 Key Information – Intel Corporation
TABLE 100 Key Information – ASE Group
TABLE 101 Key Information – Amkor Technology, Inc.
TABLE 102 Key Information – Broadcom, Inc.
TABLE 103 Key Information – Texas Instruments, Inc.
TABLE 104 Key Information – JCET Group
TABLE 105 Key Information – Powertech Technology Inc.
TABLE 106 Key Information – United Microelectronics Corporation

List of Figures
FIG 1 Methodology for the research
FIG 2 Market Share Analysis, 2022
FIG 3 Asia Pacific 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2022
FIG 4 Asia Pacific 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2029
FIG 5 Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2029, USD Million
FIG 6 Asia Pacific 3D IC and 2.5D IC Packaging Market share by End User, 2022
FIG 7 Asia Pacific 3D IC and 2.5D IC Packaging Market share by End User, 2029
FIG 8 Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2029, USD Million
FIG 9 Asia Pacific 3D IC and 2.5D IC Packaging Market share by Application, 2022
FIG 10 Asia Pacific 3D IC and 2.5D IC Packaging Market share by Application, 2029
FIG 11 asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2029, USD Million
FIG 12 Asia Pacific 3D IC and 2.5D IC Packaging Market share by Country, 2022
FIG 13 Asia Pacific 3D IC and 2.5D IC Packaging Market share by Country, 2029
FIG 14 Asia Pacific 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2029, USD Million
FIG 15 SWOT Analysis: Samsung Electronics CO. Ltd.
FIG 16 SWOT analysis: Intel corporation
FIG 17 SWOT Analysis: Broadcom, Inc.