The Asia Pacific Flip Chip Market would witness market growth of 8.6% CAGR during the forecast period (2020-2026). Flip chip has a promising ability as packaging technology to shift the scenario of traditional electrical interconnection solutions. The fundamental properties of flip chip make it a potential interconnecting packaging technology for various industries. Flip chip is one of the most researched packaging innovations for electrical interconnections because of its ability to alter the current packaging market landscape.
It provides a range of advantages, such as smaller IC footprint, reduced size, increased performance, superior reliability and thermal capability for mobile devices such as smartphones, digital cameras & cameras, and laptops & tablets. The copper pillar segment is projected to see the fastest growth leading to decreased pitch, improved performance and cost-effectiveness. 3D IC packaging is expected to have a significant market share in the near future due to an increase in the application of 3D IC to miniature consumer electronics.
Flip chip has a promising potential of IoT owing to its wide variety of applications in consumer electronics, automotive & transport, industrial, healthcare, aerospace & defense and renewable energy infrastructure. The Internet of Things (IoT) is the main driving force of the flip chip market, owing to high performance, small packaging size, and hybrid integration capacity of flip chips. The growth of the flip chip industry is largely driven by the evolving concept of IOT, a network of physical machines, cars, houses, and others, including embedded electronics, software, sensors, actuators, and network connectivity.
Based on Packaging Technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Based on Bumping Technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Based on End User, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: Flip Chip Market in Asia Pacific is expected to register a CAGR of 8.6% during the forecast period (2020-2026)
The market research report covers theanalysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
Scope of the Asia Pacific Flip Chip Market Analysis
Market Segmentation:
By Packaging Technology
By Bumping Technology
- Copper Pillar
- Gold Bumping
- Solder Bumping
- Others
By End-User
- Electronics
- Industrial
- IT & Telecom
- Automotive
- Healthcare & Life Sciences
- Aerospace & Defense
- Others
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Companies Profiled
- 3M Company
- Advanced Micro Devices, Inc.
- Amkor Technology, Inc.
- Apple, Inc.
- Fujitsu Limited
- Intel Corporation
- IBM Corporation
- Samsung Electronics Co., Ltd.
- Texas Instruments, Inc.
- Taiwan Semiconductor Manufacturing Company
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Flip Chip Market, by Packaging Technology
1.4.2 Asia Pacific Flip Chip Market, by Bumping Technology
1.4.3 Asia Pacific Flip Chip Market, by End User
1.4.4 Asia Pacific Flip Chip Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Asia Pacific Flip Chip Market by Packaging Technology
3.1 Asia Pacific Flip Chip 2.5D IC Market by Country
3.2 Asia Pacific Flip Chip 3D IC Market by Country
3.3 Asia Pacific Flip Chip 2D IC Market by Country
Chapter 4. Asia Pacific Flip Chip Market by Bumping Technology
4.1 Asia Pacific Copper Pillar Flip Chip Market by Country
4.2 Asia Pacific Gold Bumping Flip Chip Market by Country
4.3 Asia Pacific Solder Bumping Flip Chip Market by Country
4.4 Asia Pacific Other Bumping Technology Flip Chip Market by Country
Chapter 5. Asia Pacific Flip Chip Market by End User
5.1 Asia Pacific Electronics Flip Chip Market by Country
5.2 Asia Pacific Industrial Flip Chip Market by Country
5.3 Asia Pacific IT & Telecom Flip Chip Market by Country
5.4 Asia Pacific Automotive Flip Chip Market by Country
5.5 Asia Pacific Healthcare & Life Sciences Flip Chip Market by Country
5.6 Asia Pacific Aerospace & Defense Flip Chip Market by Country
5.7 Asia Pacific Others Flip Chip Market by Country
Chapter 6. Asia Pacific Flip Chip Market by Country
6.1 China Flip Chip Market
6.1.1 China Flip Chip Market by Packaging Technology
6.1.2 China Flip Chip Market by Bumping Technology
6.1.3 China Flip Chip Market by End User
6.2 Japan Flip Chip Market
6.2.1 Japan Flip Chip Market by Packaging Technology
6.2.2 Japan Flip Chip Market by Bumping Technology
6.2.3 Japan Flip Chip Market by End User
6.3 India Flip Chip Market
6.3.1 India Flip Chip Market by Packaging Technology
6.3.2 India Flip Chip Market by Bumping Technology
6.3.3 India Flip Chip Market by End User
6.4 South Korea Flip Chip Market
6.4.1 South Korea Flip Chip Market by Packaging Technology
6.4.2 South Korea Flip Chip Market by Bumping Technology
6.4.3 South Korea Flip Chip Market by End User
6.5 Singapore Flip Chip Market
6.5.1 Singapore Flip Chip Market by Packaging Technology
6.5.2 Singapore Flip Chip Market by Bumping Technology
6.5.3 Singapore Flip Chip Market by End User
6.6 Malaysia Flip Chip Market
6.6.1 Malaysia Flip Chip Market by Packaging Technology
6.6.2 Malaysia Flip Chip Market by Bumping Technology
6.6.3 Malaysia Flip Chip Market by End User
6.7 Rest of Asia Pacific Flip Chip Market
6.7.1 Rest of Asia Pacific Flip Chip Market by Packaging Technology
6.7.2 Rest of Asia Pacific Flip Chip Market by Bumping Technology
6.7.3 Rest of Asia Pacific Flip Chip Market by End User
Chapter 7. Company Profiles
7.1 3M Company
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Advanced Micro Devices, Inc.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expenses
7.3 Amkor Technology, Inc.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.4 Apple, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Product and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 SWOT Analysis
7.5 Fujitsu Limited
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 SWOT Analysis
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 IBM Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Samsung Electronics Co., Ltd. (Samsung Group)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Texas Instruments, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 SWOT Analysis
7.1 Taiwan Semiconductor Manufacturing Company
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
TABLE 1 Asia Pacific Flip Chip Market, 2016 - 2019, USD Million
TABLE 2 Asia Pacific Flip Chip Market, 2020 - 2026, USD Million
TABLE 3 Asia Pacific Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 4 Asia Pacific Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 5 Asia Pacific Flip Chip 2.5D IC Market by Country, 2016 - 2019, USD Million
TABLE 6 Asia Pacific Flip Chip 2.5D IC Market by Country, 2020 - 2026, USD Million
TABLE 7 Asia Pacific Flip Chip 3D IC Market by Country, 2016 - 2019, USD Million
TABLE 8 Asia Pacific Flip Chip 3D IC Market by Country, 2020 - 2026, USD Million
TABLE 9 Asia Pacific Flip Chip 2D IC Market by Country, 2016 - 2019, USD Million
TABLE 10 Asia Pacific Flip Chip 2D IC Market by Country, 2020 - 2026, USD Million
TABLE 11 Asia Pacific Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 12 Asia Pacific Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 13 Asia Pacific Copper Pillar Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 14 Asia Pacific Copper Pillar Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 15 Asia Pacific Gold Bumping Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 16 Asia Pacific Gold Bumping Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 17 Asia Pacific Solder Bumping Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 18 Asia Pacific Solder Bumping Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 19 Asia Pacific Other Bumping Technology Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 20 Asia Pacific Other Bumping Technology Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 21 Asia Pacific Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 22 Asia Pacific Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 23 Asia Pacific Electronics Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 24 Asia Pacific Electronics Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 25 Asia Pacific Industrial Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 26 Asia Pacific Industrial Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 27 Asia Pacific IT & Telecom Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 28 Asia Pacific IT & Telecom Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 29 Asia Pacific Automotive Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 30 Asia Pacific Automotive Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 31 Asia Pacific Healthcare & Life Sciences Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 32 Asia Pacific Healthcare & Life Sciences Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 33 Asia Pacific Aerospace & Defense Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 34 Asia Pacific Aerospace & Defense Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 35 Asia Pacific Others Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 36 Asia Pacific Others Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 37 Asia Pacific Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 38 Asia Pacific Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 39 China Flip Chip Market, 2016 - 2019, USD Million
TABLE 40 China Flip Chip Market, 2020 - 2026, USD Million
TABLE 41 China Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 42 China Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 43 China Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 44 China Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 45 China Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 46 China Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 47 Japan Flip Chip Market, 2016 - 2019, USD Million
TABLE 48 Japan Flip Chip Market, 2020 - 2026, USD Million
TABLE 49 Japan Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 50 Japan Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 51 Japan Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 52 Japan Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 53 Japan Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 54 Japan Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 55 India Flip Chip Market, 2016 - 2019, USD Million
TABLE 56 India Flip Chip Market, 2020 - 2026, USD Million
TABLE 57 India Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 58 India Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 59 India Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 60 India Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 61 India Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 62 India Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 63 South Korea Flip Chip Market, 2016 - 2019, USD Million
TABLE 64 South Korea Flip Chip Market, 2020 - 2026, USD Million
TABLE 65 South Korea Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 66 South Korea Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 67 South Korea Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 68 South Korea Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 69 South Korea Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 70 South Korea Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 71 Singapore Flip Chip Market, 2016 - 2019, USD Million
TABLE 72 Singapore Flip Chip Market, 2020 - 2026, USD Million
TABLE 73 Singapore Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 74 Singapore Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 75 Singapore Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 76 Singapore Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 77 Singapore Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 78 Singapore Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 79 Malaysia Flip Chip Market, 2016 - 2019, USD Million
TABLE 80 Malaysia Flip Chip Market, 2020 - 2026, USD Million
TABLE 81 Malaysia Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 82 Malaysia Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 83 Malaysia Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 84 Malaysia Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 85 Malaysia Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 86 Malaysia Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 87 Rest of Asia Pacific Flip Chip Market, 2016 - 2019, USD Million
TABLE 88 Rest of Asia Pacific Flip Chip Market, 2020 - 2026, USD Million
TABLE 89 Rest of Asia Pacific Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 90 Rest of Asia Pacific Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 91 Rest of Asia Pacific Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 92 Rest of Asia Pacific Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 93 Rest of Asia Pacific Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 94 Rest of Asia Pacific Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 95 Key Information – 3M Company
TABLE 96 Key information – Advanced Micro Devices, Inc.
TABLE 97 Key Information – Amkor Technology, Inc.
TABLE 98 Key Information – Apple, Inc.
TABLE 99 Key Information – Fujitsu Limited
TABLE 100 Key Information – Intel Corporation
TABLE 101 Key information – IBM Corporation
TABLE 102 Key Information –Samsung Electronics Co., Ltd.
TABLE 103 Key Information – Texas Instruments, Inc.
TABLE 104 Key Information–Taiwan Semiconductor Manufacturing Company
List of Figures
FIG 1 Methodology for the research
FIG 2 SWOT Analysis: 3M Company
FIG 3 SWOT Analysis: apple, Inc.
FIG 4 SWOT Analysis: Fujitsu Limited
FIG 5 SWOT analysis: Intel corporation
FIG 6 Swot analysis: IBM Corporation
FIG 7 SWOT Analysis: Samsung Electronics CO. Ltd.
FIG 8 SWOT Analysis: Texas Instruments, Inc.