Asia Pacific Lithography Equipment Market

Asia Pacific Lithography Equipment Market Size, Share & Trends Analysis Report By Type (Deep Ultraviolet (DUV), and Extreme Ultraviolet (EUV)), By Application, By Technology, By Packaging Platforms, By Country and Growth Forecast, 2024 - 2031

Report Id: KBV-25694 Publication Date: November-2024 Number of Pages: 148
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Analysis of Market Size & Trends

The Asia Pacific Lithography Equipment Market would witness market growth of 9.3% CAGR during the forecast period (2024-2031).

The China market dominated the Asia Pacific Lithography Equipment Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $6,334.5 million by 2031. The Japan market is registering a CAGR of 8.7% during (2024 - 2031). Additionally, The India market would witness a CAGR of 10% during (2024 - 2031).

Asia Pacific Lithography Equipment Market

Government and corporate investments in semiconductor manufacturing also bolstered the market. These substantial investments go beyond building infrastructure; they also involve acquiring advanced lithography equipment essential for manufacturing high-quality, high-performance chips. In the semiconductor manufacturing industry, lithography is a critical process that enables the production of energy-efficient, more complex, and smaller processors that are used to operate a diverse array of devices, such as smartphones and advanced military systems.

The automotive industry’s shift toward electrification and autonomous driving is another factor driving demand for lithography equipment. Electric and autonomous vehicles rely on advanced semiconductor chips to manage everything from battery efficiency to real-time data processing for autonomous navigation.

The Indian semiconductor industry was valued at approximately $23.2 billion and is expected to generate $80.3 billion by 2028. India’s semiconductor ambitions are fueled by the government’s “Make in India” and “Digital India” initiatives, which aim to establish a domestic semiconductor industry. The government recently introduced the Semicon India Program, a $10 billion incentive scheme to attract semiconductor manufacturing investments and support acquiring essential manufacturing equipment, including lithography systems.

While India’s semiconductor sector is still nascent, these programs have catalyzed partnerships with global semiconductor companies and positioned India as an emerging player in the lithography equipment market. The focus on building local manufacturing capabilities has spurred an initial demand for lithography tools to support early-stage production facilities, creating a foundation for long-term growth in this sector. Therefore, as Asia Pacific countries continue to expand their semiconductor influence, the region remains a pivotal market for lithography equipment.

Free Valuable Insights: The Global Lithography Equipment Market is Predict to reach USD 49.1 Billion by 2031, at a CAGR of 8.9%

Based on Type, the market is segmented into Deep Ultraviolet (DUV), and Extreme Ultraviolet (EUV). Based on Application, the market is segmented into Advanced Packaging, LED, MEMS, and Power Devices. Based on Technology, the market is segmented into ArF Immersion, ArF Scanners, KrF Steppers, i-line Steppers, Mask Aligners, and Other Technology. Based on Packaging Platforms, the market is segmented into 3D IC, 2.5D Interposer, Wafer Level Chip Scale Packaging (WLCSP), FO WLP Wafer, 3D WLP, and Other Packaging Platforms. Based on countries, the market is segmented into China, Japan, India, South Korea, Australia, Malaysia, and Rest of Asia Pacific.

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List of Key Companies Profiled

  • ASML Holdings N.V.
  • Canon, Inc.
  • Carl Zeiss AG
  • Nikon Corporation
  • EV Group
  • Applied Materials, Inc.
  • Lam Research Corporation
  • KLAUS Multiparking GmbH
  • ASM International N.V.
  • Thermo Fisher Scientific

Asia Pacific Lithography Equipment Market Report Segmentation

By Type

  • Deep Ultraviolet (DUV)
  • Extreme Ultraviolet (EUV)

By Application

  • Advanced Packaging
  • LED
  • MEMS
  • Power Devices

By Technology

  • ArF Immersion
  • ArF Scanners
  • KrF Steppers
  • i-line Steppers
  • Mask Aligners
  • Other Technology

By Packaging Platforms

  • 3D IC
  • 5D Interposer
  • Wafer Level Chip Scale Packaging (WLCSP)
  • FO WLP Wafer
  • 3D WLP
  • Other Packaging Platforms

By Country

  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Malaysia
  • Rest of Asia Pacific
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