Asia Pacific Molded Interconnect Device (MID) Market Size, Share & Industry Trends Analysis Report By Product Type (Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems), By Process, By Vertical, By Country and Growth Forecast, 2022 - 2028

The Asia Pacific Molded Interconnect Device (MID) Market would witness market growth of 14.2% CAGR during the forecast period (2022-2028).

MIDs provide design flexibility, which aids in product space savings by eliminating the need for additional components. This contributes to the overall weight reduction of the product. It also aids in reducing assembly times and the number of production steps by integrating sensors and circuits. This is expected to reduce additional costs while also enabling high-quality component manufacturing.

Additionally, most thermoplastics benefit from two-shot injection molding. Because the procedure involves the use of soft-touch surfaces, the finished products can have ergonomic handles or other components. This is especially true for tools, medical equipment, and other portable items. When silicone plastics or other rubbery substances are used for gaskets and other parts that need a strong seal, it provides a better seal. The bond formed is extremely strong, resulting in a good or service which is more durable, reliable, and has a longer life.

The growing number of 5G subscribers in China is expected to boost the adoption of new 5G-based devices. LDS process technology advancements by major leaders like Amphenol, Tongda Group, LPKF Laser & Electronics, and Molex would further contribute to the market growth. Further, Asian countries such as China and Japan are among the major manufacturers of consumer electronics. The demand for smartphones in India is growing due to factors including expanding telecom infrastructure, the presence of affordable smartphones, and an increase in the number of product launches.

The China market dominated the Asia Pacific Molded Interconnect Device (MID) Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $296 Million by 2028, growing at a CAGR of 12.1 % during the forecast period. The Japan market is anticipated to grow at a CAGR of 13.5% during (2022 - 2028). Additionally, The India market is poised to grow at a CAGR of 14.9% during (2022 - 2028).

Based on Product Type, the market is segmented into Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems and Others. Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding and Film Techniques. Based on Vertical, the market is segmented into Consumer Electronics, Telecommunications, Automotive, Medical, Industrial and Military & Aerospace. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

Free Valuable Insights: The Worldwide Molded Interconnect Device (MID) Market is Projected to reach USD 2.9 Billion by 2028, at a CAGR of 13.9%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Molex, LLC (Koch Industries, Inc.), TE Connectivity Ltd., Taoglas, KYOCERA AVX Components Corporation (Kyocera Corporation), Amphenol Corporation, LPKF Laser & Electronics AG, HARTING Technology Group, MID Solutions GmbH, and 2E mechatronic GmbH & Co. KG

Scope of the Study

Market Segments Covered in the Report:

By Product Type

• Antennae & Connectivity Modules
• Sensors
• Connectors & Switches
• Lighting Systems
• Others

By Process

• Laser Direct Structuring (LDS)
• Two-Shot Molding
• Film Techniques

By Vertical

• Consumer Electronics
• Telecommunications
• Automotive
• Medical
• Industrial
• Military & Aerospace

By Country

• China
• Japan
• India
• South Korea
• Singapore
• Malaysia
• Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

• Molex, LLC (Koch Industries, Inc.)
• TE Connectivity Ltd.
• Taoglas
• KYOCERA AVX Components Corporation (Kyocera Corporation)
• Amphenol Corporation
• LPKF Laser & Electronics AG
• HARTING Technology Group
• MID Solutions GmbH
• 2E mechatronic GmbH & Co. KG

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Molded Interconnect Device (MID) Market, by Product Type
1.4.2 Asia Pacific Molded Interconnect Device (MID) Market, by Process
1.4.3 Asia Pacific Molded Interconnect Device (MID) Market, by Vertical
1.4.4 Asia Pacific Molded Interconnect Device (MID) Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Asia Pacific Molded Interconnect Device (MID) Market by Product Type
3.1 Asia Pacific Antennae & Connectivity Modules Market by Country
3.2 Asia Pacific Sensors Market by Country
3.3 Asia Pacific Connectors & Switches Market by Country
3.4 Asia Pacific Lighting Systems Market by Country
3.5 Asia Pacific Others Market by Country

Chapter 4. Asia Pacific Molded Interconnect Device (MID) Market by Process
4.1 Asia Pacific Laser Direct Structuring (LDS) Market by Country
4.2 Asia Pacific Two-Shot Molding Market by Country
4.3 Asia Pacific Film Techniques Market by Country

Chapter 5. Asia Pacific Molded Interconnect Device (MID) Market by Vertical
5.1 Asia Pacific Consumer Electronics Market by Country
5.2 Asia Pacific Telecommunications Market by Country
5.3 Asia Pacific Automotive Market by Country
5.4 Asia Pacific Medical Market by Country
5.5 Asia Pacific Industrial Market by Country
5.6 Asia Pacific Military & Aerospace Market by Country

Chapter 6. Asia Pacific Molded Interconnect Device (MID) Market by Country
6.1 China Molded Interconnect Device (MID) Market
6.1.1 China Molded Interconnect Device (MID) Market by Product Type
6.1.2 China Molded Interconnect Device (MID) Market by Process
6.1.3 China Molded Interconnect Device (MID) Market by Vertical
6.2 Japan Molded Interconnect Device (MID) Market
6.2.1 Japan Molded Interconnect Device (MID) Market by Product Type
6.2.2 Japan Molded Interconnect Device (MID) Market by Process
6.2.3 Japan Molded Interconnect Device (MID) Market by Vertical
6.3 India Molded Interconnect Device (MID) Market
6.3.1 India Molded Interconnect Device (MID) Market by Product Type
6.3.2 India Molded Interconnect Device (MID) Market by Process
6.3.3 India Molded Interconnect Device (MID) Market by Vertical
6.4 South Korea Molded Interconnect Device (MID) Market
6.4.1 South Korea Molded Interconnect Device (MID) Market by Product Type
6.4.2 South Korea Molded Interconnect Device (MID) Market by Process
6.4.3 South Korea Molded Interconnect Device (MID) Market by Vertical
6.5 Singapore Molded Interconnect Device (MID) Market
6.5.1 Singapore Molded Interconnect Device (MID) Market by Product Type
6.5.2 Singapore Molded Interconnect Device (MID) Market by Process
6.5.3 Singapore Molded Interconnect Device (MID) Market by Vertical
6.6 Malaysia Molded Interconnect Device (MID) Market
6.6.1 Malaysia Molded Interconnect Device (MID) Market by Product Type
6.6.2 Malaysia Molded Interconnect Device (MID) Market by Process
6.6.3 Malaysia Molded Interconnect Device (MID) Market by Vertical
6.7 Rest of Asia Pacific Molded Interconnect Device (MID) Market
6.7.1 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Product Type
6.7.2 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Process
6.7.3 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Vertical

Chapter 7. Company Profiles
7.1 TE Connectivity Ltd.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 Recent strategies and developments:
7.1.5.1 Acquisition and Mergers:
7.1.6 SWOT Analysis
7.2 Molex, LLC (Koch Industries, Inc.)
7.2.1 Company Overview
7.2.2 Recent strategies and developments:
7.2.2.1 Acquisition and Mergers:
7.3 Taoglas
7.3.1 Company Overview
7.4 KYOCERA AVX Components Corporation (Kyocera Corporation)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.5 Amphenol Corporation
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expense
7.6 LPKF Laser & Electronics AG
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.7 HARTING Technology Group
7.7.1 Company Overview
7.8 MID Solutions GmbH
7.8.1 Company Overview
7.9 2E mechatronic GmbH & Co. KG
7.9.1 Company Overview

TABLE 1 Asia Pacific Molded Interconnect Device (MID) Market, 2018 - 2021, USD Million
TABLE 2 Asia Pacific Molded Interconnect Device (MID) Market, 2022 - 2028, USD Million
TABLE 3 Asia Pacific Molded Interconnect Device (MID) Market by Product Type, 2018 - 2021, USD Million
TABLE 4 Asia Pacific Molded Interconnect Device (MID) Market by Product Type, 2022 - 2028, USD Million
TABLE 5 Asia Pacific Antennae & Connectivity Modules Market by Country, 2018 - 2021, USD Million
TABLE 6 Asia Pacific Antennae & Connectivity Modules Market by Country, 2022 - 2028, USD Million
TABLE 7 Asia Pacific Sensors Market by Country, 2018 - 2021, USD Million
TABLE 8 Asia Pacific Sensors Market by Country, 2022 - 2028, USD Million
TABLE 9 Asia Pacific Connectors & Switches Market by Country, 2018 - 2021, USD Million
TABLE 10 Asia Pacific Connectors & Switches Market by Country, 2022 - 2028, USD Million
TABLE 11 Asia Pacific Lighting Systems Market by Country, 2018 - 2021, USD Million
TABLE 12 Asia Pacific Lighting Systems Market by Country, 2022 - 2028, USD Million
TABLE 13 Asia Pacific Others Market by Country, 2018 - 2021, USD Million
TABLE 14 Asia Pacific Others Market by Country, 2022 - 2028, USD Million
TABLE 15 Asia Pacific Molded Interconnect Device (MID) Market by Process, 2018 - 2021, USD Million
TABLE 16 Asia Pacific Molded Interconnect Device (MID) Market by Process, 2022 - 2028, USD Million
TABLE 17 Asia Pacific Laser Direct Structuring (LDS) Market by Country, 2018 - 2021, USD Million
TABLE 18 Asia Pacific Laser Direct Structuring (LDS) Market by Country, 2022 - 2028, USD Million
TABLE 19 Asia Pacific Two-Shot Molding Market by Country, 2018 - 2021, USD Million
TABLE 20 Asia Pacific Two-Shot Molding Market by Country, 2022 - 2028, USD Million
TABLE 21 Asia Pacific Film Techniques Market by Country, 2018 - 2021, USD Million
TABLE 22 Asia Pacific Film Techniques Market by Country, 2022 - 2028, USD Million
TABLE 23 Asia Pacific Molded Interconnect Device (MID) Market by Vertical, 2018 - 2021, USD Million
TABLE 24 Asia Pacific Molded Interconnect Device (MID) Market by Vertical, 2022 - 2028, USD Million
TABLE 25 Asia Pacific Consumer Electronics Market by Country, 2018 - 2021, USD Million
TABLE 26 Asia Pacific Consumer Electronics Market by Country, 2022 - 2028, USD Million
TABLE 27 Asia Pacific Telecommunications Market by Country, 2018 - 2021, USD Million
TABLE 28 Asia Pacific Telecommunications Market by Country, 2022 - 2028, USD Million
TABLE 29 Asia Pacific Automotive Market by Country, 2018 - 2021, USD Million
TABLE 30 Asia Pacific Automotive Market by Country, 2022 - 2028, USD Million
TABLE 31 Asia Pacific Medical Market by Country, 2018 - 2021, USD Million
TABLE 32 Asia Pacific Medical Market by Country, 2022 - 2028, USD Million
TABLE 33 Asia Pacific Industrial Market by Country, 2018 - 2021, USD Million
TABLE 34 Asia Pacific Industrial Market by Country, 2022 - 2028, USD Million
TABLE 35 Asia Pacific Military & Aerospace Market by Country, 2018 - 2021, USD Million
TABLE 36 Asia Pacific Military & Aerospace Market by Country, 2022 - 2028, USD Million
TABLE 37 Asia Pacific Molded Interconnect Device (MID) Market by Country, 2018 - 2021, USD Million
TABLE 38 Asia Pacific Molded Interconnect Device (MID) Market by Country, 2022 - 2028, USD Million
TABLE 39 China Molded Interconnect Device (MID) Market, 2018 - 2021, USD Million
TABLE 40 China Molded Interconnect Device (MID) Market, 2022 - 2028, USD Million
TABLE 41 China Molded Interconnect Device (MID) Market by Product Type, 2018 - 2021, USD Million
TABLE 42 China Molded Interconnect Device (MID) Market by Product Type, 2022 - 2028, USD Million
TABLE 43 China Molded Interconnect Device (MID) Market by Process, 2018 - 2021, USD Million
TABLE 44 China Molded Interconnect Device (MID) Market by Process, 2022 - 2028, USD Million
TABLE 45 China Molded Interconnect Device (MID) Market by Vertical, 2018 - 2021, USD Million
TABLE 46 China Molded Interconnect Device (MID) Market by Vertical, 2022 - 2028, USD Million
TABLE 47 Japan Molded Interconnect Device (MID) Market, 2018 - 2021, USD Million
TABLE 48 Japan Molded Interconnect Device (MID) Market, 2022 - 2028, USD Million
TABLE 49 Japan Molded Interconnect Device (MID) Market by Product Type, 2018 - 2021, USD Million
TABLE 50 Japan Molded Interconnect Device (MID) Market by Product Type, 2022 - 2028, USD Million
TABLE 51 Japan Molded Interconnect Device (MID) Market by Process, 2018 - 2021, USD Million
TABLE 52 Japan Molded Interconnect Device (MID) Market by Process, 2022 - 2028, USD Million
TABLE 53 Japan Molded Interconnect Device (MID) Market by Vertical, 2018 - 2021, USD Million
TABLE 54 Japan Molded Interconnect Device (MID) Market by Vertical, 2022 - 2028, USD Million
TABLE 55 India Molded Interconnect Device (MID) Market, 2018 - 2021, USD Million
TABLE 56 India Molded Interconnect Device (MID) Market, 2022 - 2028, USD Million
TABLE 57 India Molded Interconnect Device (MID) Market by Product Type, 2018 - 2021, USD Million
TABLE 58 India Molded Interconnect Device (MID) Market by Product Type, 2022 - 2028, USD Million
TABLE 59 India Molded Interconnect Device (MID) Market by Process, 2018 - 2021, USD Million
TABLE 60 India Molded Interconnect Device (MID) Market by Process, 2022 - 2028, USD Million
TABLE 61 India Molded Interconnect Device (MID) Market by Vertical, 2018 - 2021, USD Million
TABLE 62 India Molded Interconnect Device (MID) Market by Vertical, 2022 - 2028, USD Million
TABLE 63 South Korea Molded Interconnect Device (MID) Market, 2018 - 2021, USD Million
TABLE 64 South Korea Molded Interconnect Device (MID) Market, 2022 - 2028, USD Million
TABLE 65 South Korea Molded Interconnect Device (MID) Market by Product Type, 2018 - 2021, USD Million
TABLE 66 South Korea Molded Interconnect Device (MID) Market by Product Type, 2022 - 2028, USD Million
TABLE 67 South Korea Molded Interconnect Device (MID) Market by Process, 2018 - 2021, USD Million
TABLE 68 South Korea Molded Interconnect Device (MID) Market by Process, 2022 - 2028, USD Million
TABLE 69 South Korea Molded Interconnect Device (MID) Market by Vertical, 2018 - 2021, USD Million
TABLE 70 South Korea Molded Interconnect Device (MID) Market by Vertical, 2022 - 2028, USD Million
TABLE 71 Singapore Molded Interconnect Device (MID) Market, 2018 - 2021, USD Million
TABLE 72 Singapore Molded Interconnect Device (MID) Market, 2022 - 2028, USD Million
TABLE 73 Singapore Molded Interconnect Device (MID) Market by Product Type, 2018 - 2021, USD Million
TABLE 74 Singapore Molded Interconnect Device (MID) Market by Product Type, 2022 - 2028, USD Million
TABLE 75 Singapore Molded Interconnect Device (MID) Market by Process, 2018 - 2021, USD Million
TABLE 76 Singapore Molded Interconnect Device (MID) Market by Process, 2022 - 2028, USD Million
TABLE 77 Singapore Molded Interconnect Device (MID) Market by Vertical, 2018 - 2021, USD Million
TABLE 78 Singapore Molded Interconnect Device (MID) Market by Vertical, 2022 - 2028, USD Million
TABLE 79 Malaysia Molded Interconnect Device (MID) Market, 2018 - 2021, USD Million
TABLE 80 Malaysia Molded Interconnect Device (MID) Market, 2022 - 2028, USD Million
TABLE 81 Malaysia Molded Interconnect Device (MID) Market by Product Type, 2018 - 2021, USD Million
TABLE 82 Malaysia Molded Interconnect Device (MID) Market by Product Type, 2022 - 2028, USD Million
TABLE 83 Malaysia Molded Interconnect Device (MID) Market by Process, 2018 - 2021, USD Million
TABLE 84 Malaysia Molded Interconnect Device (MID) Market by Process, 2022 - 2028, USD Million
TABLE 85 Malaysia Molded Interconnect Device (MID) Market by Vertical, 2018 - 2021, USD Million
TABLE 86 Malaysia Molded Interconnect Device (MID) Market by Vertical, 2022 - 2028, USD Million
TABLE 87 Rest of Asia Pacific Molded Interconnect Device (MID) Market, 2018 - 2021, USD Million
TABLE 88 Rest of Asia Pacific Molded Interconnect Device (MID) Market, 2022 - 2028, USD Million
TABLE 89 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Product Type, 2018 - 2021, USD Million
TABLE 90 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Product Type, 2022 - 2028, USD Million
TABLE 91 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Process, 2018 - 2021, USD Million
TABLE 92 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Process, 2022 - 2028, USD Million
TABLE 93 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Vertical, 2018 - 2021, USD Million
TABLE 94 Rest of Asia Pacific Molded Interconnect Device (MID) Market by Vertical, 2022 - 2028, USD Million
TABLE 95 Key information –TE Connectivity Ltd.
TABLE 96 Key Information – Molex, LLC
TABLE 97 Key Information – Taoglas
TABLE 98 Key Information – KYOCERA AVX Components Corporation
TABLE 99 key information – Amphenol Corporation
TABLE 100 Key Information – LPKF Laser & Electronics AG
TABLE 101 Key Information – HARTING Technology Group
TABLE 102 Key Information – MID Solutions GmbH
TABLE 103 Key Information – 2E mechatronic GmbH & Co. KG

List of Figures
FIG 1 Methodology for the research
FIG 2 SWOT Analysis: TE Connectivity Ltd.