The Asia Pacific Through-hole Passive Components Market would witness market growth of 6.3% CAGR during the forecast period (2022-2028).
The prominent factor that is increasing the demand for through-hole passive components is the rising technological advancements in electrical and electronic devices, especially in consumer electronics. In addition, the demand from customers for sleek, thin, edge-to-edge screen coverage and low-price gadgets has boosted the trend of miniaturization.
An example of this is the application of MEMS gyroscopes in smartphones, which have achieved significant success owing to their small size, lightweight, and low price. Moreover, the recent increment in the popularity of features like voice assistants in smart devices has further increased the electronic systems’ complexities, which is favorable for the market.
In addition, prominent technologies like 5G, which are assumed to be an integral part of future devices, require larger processors, batteries, and multiple antennas. This will increase the demand for devices like large processors and radios and consecutively raise the application of through-hole passive components. Manufacturers of 5G chips are demanding package designs in smaller sizes with resistance or capacitance similar to that of larger and older versions.
In this region, various government initiatives are the primary driving forces behind the increasing demand for passive components. The growing regional electronics industry is facilitating the setup of manufacturing plants. For example, the ambition of the South Korean government to create smart industrial zones and facilitate the operation of thousands of smart factories has raised the demand for electronic parts in the nation. Additionally, technological advancements like the expeditious penetration of smartphones along with the rising number of smartphone users which is further increasing the demand for passive components.
The China market dominated the Asia Pacific Through-hole Passive Components Market by Country in 2021; thereby, achieving a market value of $5,663.3 million by 2028. The Japan market is registering a CAGR of 5.6% during (2022 - 2028). Additionally, The India market would showcase a CAGR of 7% during (2022 - 2028).
Based on Leads Model, the market is segmented into Axial and Radial. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial, IT & Telecom, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on Component, the market is segmented into Capacitors, Resistors, Inductors, Sensors, Diodes, Transducers and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: The Worldwide Through-hole Passive Components Market is Projected to reach USD 50.3 Billion by 2028, at a CAGR of 5.9%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Vishay Intertechnology, Inc., Yageo Corporation, Murata Manufacturing Co., Ltd., KYOCERA AVX Components Corporation (Kyocera Corporation), Panasonic Corporation, Bourns, Inc., TDK Corporation, TE Connectivity and Microchip Technology, Inc.
By Leads Model
By Application
By Component
By Country
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