The Global Board-to-Board Connectors Market size is expected to reach $17.5 billion by 2030, rising at a market growth of 6.2% CAGR during the forecast period.In the year 2022, the market attained a volume of 1,842.9 million units, experiencing a growth of 2.7% (2019-2022).
The demand for board-to-board connectors to facilitate connectivity between consumer electronics such as gadgets, sensors, and edge computing modules is growing as IoT devices and edge computing solutions become more widely used. Therefore, Consumer electronics segment would generate $3,943.7 million revenue in the market in 2022. As a result, there are potential for connectors that have certain qualities including low power consumption, secure connections, and durable designs for IoT and edge computing application.
The major strategies followed by the market participants are Product Launches as the key developmental strategy to keep pace with the changing demands of end users. For instance, In July, 2023, Japan Aviation Electronics Industry, Limited announced the launch of the WP55DK Series, a compact stacking type board-to-board (FPC) connector with power terminals. The launched product would be ideal for small wearable devices such as smart glasses and smartwatches. Moreover, In May, 2023, Molex, LLC launched 224G, the industry’s first chip-to-chip product offerings. The launched product would encircle next-gen cables, board-to-board connectors, backplanes, and near-ASIC connector-to-cable solutions working at speeds up to 224 Gbps-PAM4.
Based on the Analysis presented in the KBV Cardinal matrix; Amphenol Corporation and TE Connectivity Ltd. are the forerunners in the Market. In July, 2023, Kyocera Corporation unveiled 6893 Series connectors, to prevent the FPC/FFC deposits which could cause contact failure after insertion. Companies such as Kyocera Corporation, Omron Corporation, Hirose Electric Co., Ltd are some of the key innovators in the Market.
The market for board-to-board connectors is significantly driven by swift technical improvements in several industries, including electronics and telecommunications. The use of sophisticated connectors is necessary to address the constantly growing connectivity demands due to the ongoing evolution of electronic devices and developments in numerous industries. Smartphones, tablets, and wearable technology are examples of consumer electronics continually developing new features and functionalities. Because of rapid advances in technology in several industries, there is an increasing requirement for them, which is assisting market expansion.
Board-to-board connectors provide dependable connections for high-speed data transfer and computing in data center storage. Within a constrained physical space, data centers hold many servers and gadgets. Board-to-board connectors make it possible for connections to be made in small spaces, improving the data center's layout and airflow. Board-to-board connectors also make it possible to link several types of PCBs differently, making it easier to integrate specialist components and create custom solutions. The market for board-to-board connectors is anticipated to expand significantly due to the advantages of BTB connections in data centers and the expanding number of data centers globally.
Making sure that signals are sent with minimal loss, noise, and interference becomes increasingly important as data transfer rates rise. These difficulties are exacerbated by impedance control, reflection, insertion loss, crosstalk, noise, electromagnetic interference (EMI), skew, timing problems, material choice, and connection crosstalk. Delivering board-to-board connectors that satisfy the stringent demands of rapid data transfer systems depends on working with clients and considering the requirements of a certain application. The market's growth is anticipated to be slow throughout the forecast period due to these specific technical difficulties and complexities.
The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Product Launches and Product Expansions.
On the basis of component, the market is fragmented into less than 1mm, 1mm to 2mm, and greater than 2mm. The less than 1mm segment garnered a significant revenue share in the market in 2022. Electronic equipment across various industries is increasingly becoming more miniature and compact. In order to accommodate the integration of components within constrained locations, board-to-board connectors with smaller pitch widths are required due to the rising need for smaller, lighter, and more portable systems. The compactness required for these miniature designs is provided by connectors with a pitch size of less than 1 mm.
By type, the market is segmented into pin headers, stacked header, shrouded header, and socket. The pin headers segment held the highest revenue share in the market in 2022. Pin headers are often more affordable compared to other kinds of board-to-board connectors. Due to their straightforward structure and design, they are competitively priced and extremely simple to produce. Because of their affordability, pin headers are frequently used in applications that call for several connectors or where cost is crucial. Pin headers are also user-friendly and simple to put together.
Based on end user, the market is segmented into consumer electronics, industrial automation, telecommunication, automotive, healthcare, and others. In 2022, the telecommunication segment procured a promising growth rate in the market. Especially in base stations & routers, board-to-board connectors are widely employed in communications equipment. High levels of flexibility are provided, and it is simple to update and increase capacity. Additionally, they enable different data rates and provide outstanding EMI shielding. Board-to-board interfaces will become even more crucial in communications applications as demand for larger bandwidths rises.
| Report Attribute | Details |
|---|---|
| Market size value in 2022 | USD 10.9 Billion |
| Market size forecast in 2030 | USD 17.5 Billion |
| Base Year | 2022 |
| Historical Period | 2019 to 2021 |
| Forecast Period | 2023 to 2030 |
| Revenue Growth Rate | CAGR of 6.2% from 2023 to 2030 |
| Number of Pages | 449 |
| Number of Table | 893 |
| Quantitative Data | Volume in Million units; revenue in USD Million, and CAGR from 2019 to 2030 |
| Report coverage | Market Trends, Revenue Estimation and Forecast, Segmentation Analysis, Regional and Country Breakdown, Competitive Landscape, Market Share Analysis, Companies Strategic Developments, Company Profiling |
| Segments covered | Type, Pitch, Application, Region |
| Country scope | US, Canada, Mexico, Germany, UK, France, Russia, Spain, Italy, China, Japan, India, South Korea, Singapore, Malaysia, Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria |
| Growth Drivers |
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| Restraints |
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Region wise, the market is analysed across North America, Europe, Asia Pacific and LAMEA. In 2022, the Asia Pacific region led the market by generating the highest revenue share. The Asia Pacific region is home to many nations actively looking into smart manufacturing programs and implementing Industry 4.0 innovations. This includes incorporating automation, robotics, IoT, and data analytics into the production processes. Board-to-board connections are essential for enabling smooth connectivity and communication between various components in smart manufacturing systems, which is fuelling market expansion.
Free Valuable Insights: Global Board-to-Board Connectors Market size to reach USD 17.5 Billion by 2030
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).
By Type(Volume, Million Units, USD Million, 2019-2030)
By Pitch(Volume, Million Units, USD Million, 2019-2030)
By Application(Volume, Million Units, USD Million, 2019-2030)
By Geography(Volume, Million Units, USD Million, 2019-2030)
This Market size is expected to reach $17.5 billion by 2030.
Continuous Technological Advances are driving the Market in coming years, however, Technical Complexity and challenges restraints the growth of the Market.
Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).
The expected CAGR of this Market is 6.2% from 2023 to 2030.
The 1 mm to 2 mm segment is leading the Market by Pitch in 2022; thereby, achieving a market value of $8.4 billion by 2030.
The North America region dominated the Market by Region in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $4.9 billion by 2030.
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