Europe 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Country and Growth Forecast, 2023 - 2029

The Europe 3D IC and 2.5D IC Packaging Market would witness market growth of 9.6% CAGR during the forecast period (2023-2029).

3D ICs and 2.5D ICs have the best electronic architecture. In the future, IC packaging will be required for all electrical devices. The market is consequently closely related to increasing sales and demand. The need for these semiconductors is increasing as modern technologies like high-performance computers, artificial intelligence (AI), and 5G continue to develop. Utilizing these devices enhances the bandwidth, performance, as well as latency of electronic equipment. The demand for smartphones, tablets, and gaming devices, as well as other factors, are also driving the business. In addition, demand is also anticipated to increase due to the growing adoption of advanced design in electronic goods and the move toward smaller electronic devices.

ICs are frequently the primary source of power for medical devices. These include blood collection tools, heart monitors, and some kinds of surgical instruments. As a result, surgery has been more effective because of IC-powered medical equipment, which has improved patient outcomes. These tools let surgeons carry out procedures more precisely and avoid numerous common human errors.

The European semiconductor industry is represented by an organization known as ESIA, which stands for the European Semiconductor Industry Association. In addition to advancing economic growth and responding to pressing societal issues as a supplier of essential supporting technologies, the sector offers creative solutions for the growth of local enterprises. In general, micro- and nanoelectronics allow Europe and the rest of the globe to produce at least 10% of GDP. Furthermore, IC packaging solutions in this region would benefit from expanding the semiconductor sector. Therefore, this element will fuel the regional market's expansion in the upcoming years.

The Germany market dominated the Europe 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $4,544.2 Million by 2029. The UK market is estimated to grow at a CAGR of 8.7% during (2023 - 2029). Additionally, The France market would exhibit a CAGR of 10.4% during (2023 - 2029).

Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

Free Valuable Insights: The Worldwide 3D IC and 2.5D IC Packaging Market is Projected to reach USD 83 Billion by 2029, at a CAGR of 10.1%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.

Scope of the Study

Market Segments Covered in the Report:

By Packaging Technology

• 2.5D
• 3D wafer-level chip-scale packaging (WLCSP)
• 3D Through-silicon via (TSV)

By End User

• Consumer Electronics
• Automotive
• Industrial
• Military & Aerospace
• Telecommunications
• Medical Devices & Others

By Application

• Memory
• Imaging & Optoelectronics
• MEMS/Sensors
• Logic
• LED
• Others

By Country

• Germany
• UK
• France
• Russia
• Spain
• Italy
• Rest of Europe

Key Market Players

List of Companies Profiled in the Report:

• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company Limited
• Intel Corporation
• ASE Group (ASE Technology Holding Co., Ltd.)
• Amkor Technology, Inc.
• Broadcom, Inc.
• Texas Instruments, Inc.
• JCET Group
• Powertech Technology, Inc.
• United Microelectronics Corporation

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe 3D IC and 2.5D IC Packaging Market, by Packaging Technology
1.4.2 Europe 3D IC and 2.5D IC Packaging Market, by End User
1.4.3 Europe 3D IC and 2.5D IC Packaging Market, by Application
1.4.4 Europe 3D IC and 2.5D IC Packaging Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis – Global
3.1 Market Share Analysis, 2022

Chapter 4. Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology
4.1 Europe 2.5D Market by Country
4.2 Europe 3D wafer-level chip-scale packaging (WLCSP) Market by Country
4.3 Europe 3D Through-silicon via (TSV) Market by Country

Chapter 5. Europe 3D IC and 2.5D IC Packaging Market by End User
5.1 Europe Consumer Electronics Market by Country
5.2 Europe Automotive Market by Country
5.3 Europe Industrial Market by Country
5.4 Europe Military & Aerospace Market by Country
5.5 Europe Telecommunications Market by Country
5.6 Europe Medical Devices & Others Market by Country

Chapter 6. Europe 3D IC and 2.5D IC Packaging Market by Application
6.1 Europe Memory Market by Country
6.2 Europe Imaging & Optoelectronics Market by Country
6.3 Europe MEMS/Sensors Market by Country
6.4 Europe Logic Market by Country
6.5 Europe LED Market by Country
6.6 Europe Others Market by Country

Chapter 7. Europe 3D IC and 2.5D IC Packaging Market by Country
7.1 Germany 3D IC and 2.5D IC Packaging Market
7.1.1 Germany 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.2 Germany 3D IC and 2.5D IC Packaging Market by End User
7.1.3 Germany 3D IC and 2.5D IC Packaging Market by Application
7.2 UK 3D IC and 2.5D IC Packaging Market
7.2.1 UK 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.2 UK 3D IC and 2.5D IC Packaging Market by End User
7.2.3 UK 3D IC and 2.5D IC Packaging Market by Application
7.3 France 3D IC and 2.5D IC Packaging Market
7.3.1 France 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.2 France 3D IC and 2.5D IC Packaging Market by End User
7.3.3 France 3D IC and 2.5D IC Packaging Market by Application
7.4 Russia 3D IC and 2.5D IC Packaging Market
7.4.1 Russia 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.2 Russia 3D IC and 2.5D IC Packaging Market by End User
7.4.3 Russia 3D IC and 2.5D IC Packaging Market by Application
7.5 Spain 3D IC and 2.5D IC Packaging Market
7.5.1 Spain 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.5.2 Spain 3D IC and 2.5D IC Packaging Market by End User
7.5.3 Spain 3D IC and 2.5D IC Packaging Market by Application
7.6 Italy 3D IC and 2.5D IC Packaging Market
7.6.1 Italy 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.6.2 Italy 3D IC and 2.5D IC Packaging Market by End User
7.6.3 Italy 3D IC and 2.5D IC Packaging Market by Application
7.7 Rest of Europe 3D IC and 2.5D IC Packaging Market
7.7.1 Rest of Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.7.2 Rest of Europe 3D IC and 2.5D IC Packaging Market by End User
7.7.3 Rest of Europe 3D IC and 2.5D IC Packaging Market by Application

Chapter 8. Company Profiles
8.1 Samsung Electronics Co., Ltd. (Samsung Group)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.6 SWOT Analysis
8.2 Taiwan Semiconductor Manufacturing Company Limited
8.2.1 Company overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expenses
8.3 Intel Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expenses
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding Co., Ltd.)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Research & Development Expense
8.5.4 Recent strategies and developments:
8.5.4.1 Partnerships, Collaborations, and Agreements:
8.6 Broadcom, Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 SWOT Analysis
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. United Microelectronics Corporation
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Regional Analysis
8.10.4 Research & Development Expenses

TABLE 1 Europe 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 2 Europe 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 3 Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 4 Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 5 Europe 2.5D Market by Country, 2019 - 2022, USD Million
TABLE 6 Europe 2.5D Market by Country, 2023 - 2029, USD Million
TABLE 7 Europe 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2019 - 2022, USD Million
TABLE 8 Europe 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2023 - 2029, USD Million
TABLE 9 Europe 3D Through-silicon via (TSV) Market by Country, 2019 - 2022, USD Million
TABLE 10 Europe 3D Through-silicon via (TSV) Market by Country, 2023 - 2029, USD Million
TABLE 11 Europe 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 12 Europe 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 13 Europe Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 14 Europe Consumer Electronics Market by Country, 2023 - 2029, USD Million
TABLE 15 Europe Automotive Market by Country, 2019 - 2022, USD Million
TABLE 16 Europe Automotive Market by Country, 2023 - 2029, USD Million
TABLE 17 Europe Industrial Market by Country, 2019 - 2022, USD Million
TABLE 18 Europe Industrial Market by Country, 2023 - 2029, USD Million
TABLE 19 Europe Military & Aerospace Market by Country, 2019 - 2022, USD Million
TABLE 20 Europe Military & Aerospace Market by Country, 2023 - 2029, USD Million
TABLE 21 Europe Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 22 Europe Telecommunications Market by Country, 2023 - 2029, USD Million
TABLE 23 Europe Medical Devices & Others Market by Country, 2019 - 2022, USD Million
TABLE 24 Europe Medical Devices & Others Market by Country, 2023 - 2029, USD Million
TABLE 25 Europe 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 26 Europe 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 27 Europe Memory Market by Country, 2019 - 2022, USD Million
TABLE 28 Europe Memory Market by Country, 2023 - 2029, USD Million
TABLE 29 Europe Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 30 Europe Imaging & Optoelectronics Market by Country, 2023 - 2029, USD Million
TABLE 31 Europe MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 32 Europe MEMS/Sensors Market by Country, 2023 - 2029, USD Million
TABLE 33 Europe Logic Market by Country, 2019 - 2022, USD Million
TABLE 34 Europe Logic Market by Country, 2023 - 2029, USD Million
TABLE 35 Europe LED Market by Country, 2019 - 2022, USD Million
TABLE 36 Europe LED Market by Country, 2023 - 2029, USD Million
TABLE 37 Europe Others Market by Country, 2019 - 2022, USD Million
TABLE 38 Europe Others Market by Country, 2023 - 2029, USD Million
TABLE 39 Europe 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2022, USD Million
TABLE 40 Europe 3D IC and 2.5D IC Packaging Market by Country, 2023 - 2029, USD Million
TABLE 41 Germany 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 42 Germany 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 43 Germany 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 44 Germany 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 45 Germany 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 46 Germany 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 47 Germany 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 48 Germany 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 49 UK 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 50 UK 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 51 UK 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 52 UK 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 53 UK 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 54 UK 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 55 UK 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 56 UK 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 57 France 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 58 France 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 59 France 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 60 France 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 61 France 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 62 France 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 63 France 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 64 France 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 65 Russia 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 66 Russia 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 67 Russia 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 68 Russia 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 69 Russia 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 70 Russia 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 71 Russia 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 72 Russia 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 73 Spain 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 74 Spain 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 75 Spain 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 76 Spain 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 77 Spain 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 78 Spain 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 79 Spain 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 80 Spain 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 81 Italy 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 82 Italy 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 83 Italy 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 84 Italy 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 85 Italy 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 86 Italy 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 87 Italy 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 88 Italy 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 89 Rest of Europe 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 90 Rest of Europe 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 91 Rest of Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 92 Rest of Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 93 Rest of Europe 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 94 Rest of Europe 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 95 Rest of Europe 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 96 Rest of Europe 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 97 Key Information – Samsung Electronics Co., Ltd.
TABLE 98 Key Information– Taiwan Semiconductor Manufacturing Company Limited
TABLE 99 Key Information – Intel Corporation
TABLE 100 Key Information – ASE Group
TABLE 101 Key Information – Amkor Technology, Inc.
TABLE 102 Key Information – Broadcom, Inc.
TABLE 103 Key Information – Texas Instruments, Inc.
TABLE 104 Key Information – JCET Group
TABLE 105 Key Information – Powertech Technology Inc.
TABLE 106 Key Information – United Microelectronics Corporation

List of Figures
FIG 1 Methodology for the research
FIG 2 Market Share Analysis, 2022
FIG 3 Europe 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2022
FIG 4 Europe 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2029
FIG 5 Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2029, USD Million
FIG 6 Europe 3D IC and 2.5D IC Packaging Market share by End User, 2022
FIG 7 Europe 3D IC and 2.5D IC Packaging Market share by End User, 2029
FIG 8 Europe 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2029, USD Million
FIG 9 Europe 3D IC and 2.5D IC Packaging Market share by Application, 2022
FIG 10 Europe 3D IC and 2.5D IC Packaging Market share by Application, 2029
FIG 11 Europe 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2029, USD Million
FIG 12 Europe 3D IC and 2.5D IC Packaging Market share by Country, 2022
FIG 13 Europe 3D IC and 2.5D IC Packaging Market share by Country, 2029
FIG 14 Europe 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2029, USD Million
FIG 15 SWOT Analysis: Samsung Electronics CO. Ltd.
FIG 16 SWOT analysis: Intel corporation
FIG 17 SWOT Analysis: Broadcom, Inc.