The Europe Advanced Packaging Market would witness market growth of 12.3% CAGR during the forecast period (2020-2026). With rapid growth in the advanced packaging market, particularly in wafer level packaging, together with increased demand for smartphones and devices and the Internet of Things (IoT), advanced packaging suppliers are developing processes and ways to reduce the overall cost of advanced packaging and ensure maximum operational efficiency.
In recent times, innovative packaging is primarily used for high-end products and for niche-related applications such as wafer and die processing due to high operating costs. Different integrated circuits (ICs) have various packaging requirements that provide growth opportunities for advanced packaging over traditional packaging processes. Furthermore, advanced packaging is expected to offer higher capabilities than conventional packaging solutions, which are expected to provide lucrative opportunities for advanced packaging market trends in the coming years.
The demand for compact electronic devices has increased in almost every sector, be it communication equipment, automotive, industrial or healthcare equipment. This trend has prompted semiconductor IC manufacturers to increase R&D investment in order to reduce the size and improve the output of ICs. This led to the advent of MEMS and 3D IC chips. In addition, over the decades, ICs have often been more dense due to the growing number of interconnects and transistors requiring better deposition and patterning.
Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D and Others. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
Free Valuable Insights: Advanced Packaging Market in Europe is expected to register a CAGR of 12.3% during the forecast period (2020-2026)
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.
Scope of the Europe Advanced Packaging Market Analysis
Market Segmentation:
By Type
- Flip-Chip Ball Grid Array
- Flip Chip CSP
- Wafer Level CSP
- 5D/3D
- Others
By End-User
- Consumer Electronics
- Automotive
- Industrial
- Aerospace & Defense
- Healthcare & Life Sciences
- Others
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Companies Profiled
- Qualcomm, Inc.
- Intel Corporation
- IBM Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co., Ltd. (Samsung Group)
- Amkor Technology, Inc.
- Brewer Science, Inc.
- Microchip Technology, Inc.
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Advanced Packaging Market, by Type
1.4.2 Europe Advanced Packaging Market, by End User
1.4.3 Europe Advanced Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 KBV Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Geographical Expansions
3.2.4 Mergers & Acquisitions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020)
3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements : 2016, Jan – 2019,Dec) Leading Players
Chapter 4. Europe Advanced Packaging Market by Type
4.1 Europe Advanced Packaging Flip-Chip Ball Grid Array Market by Country
4.2 Europe Advanced Packaging Flip Chip CSP Market by Country
4.3 Europe Advanced Packaging Wafer Level CSP Market by Country
4.4 Europe Advanced Packaging 2.5D/3D Market by Country
4.5 Europe Other Type Advanced Packaging Market by Country
Chapter 5. Europe Advanced Packaging Market by End User
5.1 Europe Consumer Electronics Advanced Packaging Market by Country
5.2 Europe Automotive Advanced Packaging Market by Country
5.3 Europe Industrial Advanced Packaging Market by Country
5.4 Europe Aerospace & Defense Advanced Packaging Market by Country
5.5 Europe Healthcare & Life Sciences Advanced Packaging Market by Country
5.6 Europe Others Advanced Packaging Market by Country
Chapter 6. Europe Advanced Packaging Market by Country
6.1 Germany Advanced Packaging Market
6.1.1 Germany Advanced Packaging Market by Type
6.1.2 Germany Advanced Packaging Market by End User
6.2 UK Advanced Packaging Market
6.2.1 UK Advanced Packaging Market by Type
6.2.2 UK Advanced Packaging Market by End User
6.3 France Advanced Packaging Market
6.3.1 France Advanced Packaging Market by Type
6.3.2 France Advanced Packaging Market by End User
6.4 Russia Advanced Packaging Market
6.4.1 Russia Advanced Packaging Market by Type
6.4.2 Russia Advanced Packaging Market by End User
6.5 Spain Advanced Packaging Market
6.5.1 Spain Advanced Packaging Market by Type
6.5.2 Spain Advanced Packaging Market by End User
6.6 Italy Advanced Packaging Market
6.6.1 Italy Advanced Packaging Market by Type
6.6.2 Italy Advanced Packaging Market by End User
6.7 Rest of Europe Advanced Packaging Market
6.7.1 Rest of Europe Advanced Packaging Market by Type
6.7.2 Rest of Europe Advanced Packaging Market by End User
Chapter 7. Company Profiles
7.1 Qualcomm, Inc.
7.1.1 Company Overview
7.1.1 Financial Analysis
7.1.2 Segmental and Regional Analysis
7.1.3 Research & Development Expense
7.1.4 Recent strategies and developments:
7.1.4.1 Partnerships, Collaborations, and Agreements:
7.1.4.2 Geographical Expansions:
7.1.5 SWOT Analysis
7.2 Intel Corporation
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expenses
7.2.5 Recent strategies and developments:
7.2.5.1 Partnerships, Collaborations, and Agreements:
7.2.5.2 Product Launches and Product Expansions:
7.2.6 SWOT Analysis
7.3 IBM Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.3.6 SWOT Analysis
7.4 Texas Instruments, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments:
7.4.5.1 Product Launches and Product Expansions:
7.4.6 SWOT Analysis
7.5 Analog Devices, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 SWOT Analysis
7.6 Renesas Electronics Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.6.5 Recent strategies and developments:
7.6.5.1 Product Launches and Product Expansions:
7.6.5.2 Acquisition and Mergers:
7.7 Samsung Electronics Co., Ltd. (Samsung Group)
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Partnerships, Collaborations, and Agreements:
7.7.5.2 Geographical Expansions:
7.7.6 SWOT Analysis
7.8 Amkor Technology, Inc.
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Regional Analysis
7.8.4 Research & Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Partnerships, Collaborations, and Agreements:
7.8.5.2 Acquisition and Mergers:
7.9 Brewer Science, Inc.
7.9.1 Company Overview
7.9.2 Recent strategies and developments:
7.9.2.1 Product Launches and Product Expansions:
7.1 Microchip Technology, Inc.
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 Recent strategies and developments:
7.10.5.1 Geographical Expansions:
TABLE 1 Europe Advanced Packaging Market, 2016 - 2019, USD Million
TABLE 2 Europe Advanced Packaging Market, 2020 - 2026, USD Million
TABLE 3 Partnerships, Collaborations and Agreements– Advanced Packaging Market
TABLE 4 Product Launches And Product Expansions– Advanced Packaging Market
TABLE 5 Geographical Expansions– Advanced Packaging Market
TABLE 6 Mergers & Acquisitions – Advanced Packaging Market
TABLE 7 Europe Advanced Packaging Market by Type, 2016 - 2019, USD Million
TABLE 8 Europe Advanced Packaging Market by Type, 2020 - 2026, USD Million
TABLE 9 Europe Advanced Packaging Flip-Chip Ball Grid Array Market by Country, 2016 - 2019, USD Million
TABLE 10 Europe Advanced Packaging Flip-Chip Ball Grid Array Market by Country, 2020 - 2026, USD Million
TABLE 11 Europe Advanced Packaging Flip Chip CSP Market by Country, 2016 - 2019, USD Million
TABLE 12 Europe Advanced Packaging Flip Chip CSP Market by Country, 2020 - 2026, USD Million
TABLE 13 Europe Advanced Packaging Wafer Level CSP Market by Country, 2016 - 2019, USD Million
TABLE 14 Europe Advanced Packaging Wafer Level CSP Market by Country, 2020 - 2026, USD Million
TABLE 15 Europe Advanced Packaging 2.5D/3D Market by Country, 2016 - 2019, USD Million
TABLE 16 Europe Advanced Packaging 2.5D/3D Market by Country, 2020 - 2026, USD Million
TABLE 17 Europe Other Type Advanced Packaging Market by Country, 2016 - 2019, USD Million
TABLE 18 Europe Other Type Advanced Packaging Market by Country, 2020 - 2026, USD Million
TABLE 19 Europe Advanced Packaging Market by End User, 2016 - 2019, USD Million
TABLE 20 Europe Advanced Packaging Market by End User, 2020 - 2026, USD Million
TABLE 21 Europe Consumer Electronics Advanced Packaging Market by Country, 2016 - 2019, USD Million
TABLE 22 Europe Consumer Electronics Advanced Packaging Market by Country, 2020 - 2026, USD Million
TABLE 23 Europe Automotive Advanced Packaging Market by Country, 2016 - 2019, USD Million
TABLE 24 Europe Automotive Advanced Packaging Market by Country, 2020 - 2026, USD Million
TABLE 25 Europe Industrial Advanced Packaging Market by Country, 2016 - 2019, USD Million
TABLE 26 Europe Industrial Advanced Packaging Market by Country, 2020 - 2026, USD Million
TABLE 27 Europe Aerospace & Defense Advanced Packaging Market by Country, 2016 - 2019, USD Million
TABLE 28 Europe Aerospace & Defense Advanced Packaging Market by Country, 2020 - 2026, USD Million
TABLE 29 Europe Healthcare & Life Sciences Advanced Packaging Market by Country, 2016 - 2019, USD Million
TABLE 30 Europe Healthcare & Life Sciences Advanced Packaging Market by Country, 2020 - 2026, USD Million
TABLE 31 Europe Others Advanced Packaging Market by Country, 2016 - 2019, USD Million
TABLE 32 Europe Others Advanced Packaging Market by Country, 2020 - 2026, USD Million
TABLE 33 Europe Advanced Packaging Market by Country, 2016 - 2019, USD Million
TABLE 34 Europe Advanced Packaging Market by Country, 2020 - 2026, USD Million
TABLE 35 Germany Advanced Packaging Market, 2016 - 2019, USD Million
TABLE 36 Germany Advanced Packaging Market, 2020 - 2026, USD Million
TABLE 37 Germany Advanced Packaging Market by Type, 2016 - 2019, USD Million
TABLE 38 Germany Advanced Packaging Market by Type, 2020 - 2026, USD Million
TABLE 39 Germany Advanced Packaging Market by End User, 2016 - 2019, USD Million
TABLE 40 Germany Advanced Packaging Market by End User, 2020 - 2026, USD Million
TABLE 41 UK Advanced Packaging Market, 2016 - 2019, USD Million
TABLE 42 UK Advanced Packaging Market, 2020 - 2026, USD Million
TABLE 43 UK Advanced Packaging Market by Type, 2016 - 2019, USD Million
TABLE 44 UK Advanced Packaging Market by Type, 2020 - 2026, USD Million
TABLE 45 UK Advanced Packaging Market by End User, 2016 - 2019, USD Million
TABLE 46 UK Advanced Packaging Market by End User, 2020 - 2026, USD Million
TABLE 47 France Advanced Packaging Market, 2016 - 2019, USD Million
TABLE 48 France Advanced Packaging Market, 2020 - 2026, USD Million
TABLE 49 France Advanced Packaging Market by Type, 2016 - 2019, USD Million
TABLE 50 France Advanced Packaging Market by Type, 2020 - 2026, USD Million
TABLE 51 France Advanced Packaging Market by End User, 2016 - 2019, USD Million
TABLE 52 France Advanced Packaging Market by End User, 2020 - 2026, USD Million
TABLE 53 Russia Advanced Packaging Market, 2016 - 2019, USD Million
TABLE 54 Russia Advanced Packaging Market, 2020 - 2026, USD Million
TABLE 55 Russia Advanced Packaging Market by Type, 2016 - 2019, USD Million
TABLE 56 Russia Advanced Packaging Market by Type, 2020 - 2026, USD Million
TABLE 57 Russia Advanced Packaging Market by End User, 2016 - 2019, USD Million
TABLE 58 Russia Advanced Packaging Market by End User, 2020 - 2026, USD Million
TABLE 59 Spain Advanced Packaging Market, 2016 - 2019, USD Million
TABLE 60 Spain Advanced Packaging Market, 2020 - 2026, USD Million
TABLE 61 Spain Advanced Packaging Market by Type, 2016 - 2019, USD Million
TABLE 62 Spain Advanced Packaging Market by Type, 2020 - 2026, USD Million
TABLE 63 Spain Advanced Packaging Market by End User, 2016 - 2019, USD Million
TABLE 64 Spain Advanced Packaging Market by End User, 2020 - 2026, USD Million
TABLE 65 Italy Advanced Packaging Market, 2016 - 2019, USD Million
TABLE 66 Italy Advanced Packaging Market, 2020 - 2026, USD Million
TABLE 67 Italy Advanced Packaging Market by Type, 2016 - 2019, USD Million
TABLE 68 Italy Advanced Packaging Market by Type, 2020 - 2026, USD Million
TABLE 69 Italy Advanced Packaging Market by End User, 2016 - 2019, USD Million
TABLE 70 Italy Advanced Packaging Market by End User, 2020 - 2026, USD Million
TABLE 71 Rest of Europe Advanced Packaging Market, 2016 - 2019, USD Million
TABLE 72 Rest of Europe Advanced Packaging Market, 2020 - 2026, USD Million
TABLE 73 Rest of Europe Advanced Packaging Market by Type, 2016 - 2019, USD Million
TABLE 74 Rest of Europe Advanced Packaging Market by Type, 2020 - 2026, USD Million
TABLE 75 Rest of Europe Advanced Packaging Market by End User, 2016 - 2019, USD Million
TABLE 76 Rest of Europe Advanced Packaging Market by End User, 2020 - 2026, USD Million
TABLE 77 Key Information – Qualcomm, Inc.
TABLE 78 Key Information – Intel Corporation
TABLE 79 Key information – IBM Corporation
TABLE 80 Key Information – Texas Instruments, Inc.
TABLE 81 key information – Analog Devices, Inc.
TABLE 82 key information – Renesas Electronics Corporation
TABLE 83 Key Information –Samsung Electronics Co., Ltd.
TABLE 84 Key Information – Amkor Technology, Inc.
TABLE 85 Key Information – Brewer Science, Inc.
TABLE 86 Key Information – Microchip Technology, Inc.
List of Figures
FIG 1 Methodology for the research
FIG 2 KBV Cardinal Matrix
FIG 3 Key Leading Strategies: Percentage Distribution (2016-2020)
FIG 4 Key Strategic Move: (Partnerships, Collaborations, and Agreements : 2016, Jan – 2019,Dec) Leading Players
FIG 5 Recent strategies and developments: Qualcomm, Inc.
FIG 6 SWOT Analysis: Qualcomm, Inc.
FIG 7 Recent strategies and developments: Intel Corporation
FIG 8 SWOT analysis: Intel corporation
FIG 9 Swot analysis: IBM Corporation
FIG 10 SWOT Analysis: Texas Instruments, Inc.
FIG 11 Swot analysis: analog devices, inc.
FIG 12 Recent strategies and developments: Renesas Electronics Corporation
FIG 13 Recent strategies and developments: Samsung Electronics Co., Ltd.
FIG 14 SWOT Analysis: Samsung Electronics CO. Ltd.
FIG 15 Recent strategies and developments: Amkor Technology, Inc.