Europe Board-to-Board Connectors Market

Europe Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Country and Growth Forecast, 2023 - 2030

Report Id: KBV-16813 Publication Date: August-2023 Number of Pages: 183
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Analysis of Market Size & Trends

The Europe Board-to-Board Connectors Market would witness market growth of 6.0% CAGR during the forecast period (2023-2030).In the year 2020, the Europe market's volume surged to 402.7 million units, showcasing a growth of 2.5% (2019-2022).

The market for board-to-board connectors has been impacted by the decreasing price gap between the various brands and industry competitors. The need for BTB connectors is increasing along with the performance levels of products. The market expansion for BTB connectors has been impacted by the expanding varieties of products and exceptional after-sales services. According to research, the BTB connections market is dominated by high-end or premium products.

To make single-board computers (SBCs) tiny, designers must cram as much processing power, functionality, and I/O onto that circuit board. Multiple computer boards are necessary because a single board design cannot realistically address industrial, consumer, and medical applications. Board-to-board (BTB) connectors are utilized for connecting several boards in this situation and become extremely crucial.

Given that 77 percent of Germans live in cities and towns, it is commonly understood that smart urban development employing digital technology is important. The disruption of modern urban living by technology has an opportunity to improve living standards. With all of this, the region would see a dramatic increase in adopting items like smart thermostats, lighting control, and others. The market for board-to-board connectors, which are utilized to connect control units to various sensors, will ultimately grow as a result.

The Germany market dominated the Europe Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,049.9 million by 2030. The UK market is registering a CAGR of 5.1% during (2023 - 2030). Additionally, The France market would showcase a CAGR of 6.7% during (2023 - 2030).

Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

Free Valuable Insights: The Worldwide Board-to-Board Connectors Market is Projected to reach USD 17.5 Billion by 2030, at a CAGR of 6.2%

The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).

Scope of the Study

Market Segments Covered in the Report:

By Type (Volume, Million Units, USD Million, 2019-2030)

  • Pin Headers
    • Stacked Header
    • Shrouded Header
  • Socket

By Pitch (Volume, Million Units, USD Million, 2019-2030)

  • 1 mm to 2 mm
  • Greater Than 2 mm
  • Less Than 1 mm

By Application (Volume, Million Units, USD Million, 2019-2030)

  • Consumer Electronics
  • Automotive
  • Industrial Automation
  • Healthcare
  • Telecommunication
  • Others

By Country (Volume, Million Units, USD Million, 2019-2030)

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Key Market Players

List of Companies Profiled in the Report:

  • Amphenol Corporation
  • TE Connectivity Ltd.
  • Molex, LLC (Koch Industries, Inc.)
  • Kyocera Corporation
  • HARTING Technology Group
  • Omron Corporation
  • Japan Aviation Electronics Industry, Limited
  • Hirose Electric Co., Ltd
  • Samtec
  • FIT Hon Teng Limited (Foxconn (Far East) Limited)
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