The Europe Embedded Die Packaging Technology Market would witness market growth of 18.4% CAGR during the forecast period (2022-2028).
Embedded die packaging facilitates the trend toward modularization with a less expensive setup. Additionally, the integrated die packaging technology's concealed components to guard against the possibility of electronic device counterfeiting and reverse engineering.
In the following years, embedded die packaging technology is projected to become more popular and used in various industries, including mobile phones, wearable technology, medical devices, and automobiles.
Signal integrity may be maintained in RF and high-power industrial applications using integrated die packaging while minimizing parasitics and device-to-device reproducibility. Additionally, special process capacity enables the adaptation of various material sets and substrates, including enormous temperature extremes, with hundreds of hours of cycling in accelerated life tests, to the application requirements.
Small- to medium-sized businesses are a well-established part of the medical technology sector in Europe. The United Kingdom is home to several head offices and subsidiaries of different multinational corporations, including those of the top US producers of medical technology. In addition, there is a growing need for wearable skin adhesives, comprising health analytical devices, monitoring devices, and clinical efficiency tools. The need to downsize electronic devices will increase due to the increased demand for wearable technology and the healthcare industry's willingness to adopt cutting-edge technologies.
The Germany market dominated the Europe Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $11,917.6 Thousands by 2028.The UK market is anticipated to grow at a CAGR of 17.4% during (2022 - 2028). Additionally, The France market would exhibit a CAGR of 19.2% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
Free Valuable Insights: The Global Embedded Die Packaging Technology Market will Hit $214.1 Million by 2028, at a CAGR of 18.6%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
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