Europe Power over Ethernet Chipsets Market Analysis (2018-2024)
The Europe Power over Ethernet Chipsets Market would witness market growth of 10% CAGR during the forecast period (2018 ? 2024). Favorable regulatory frameworks in European Union are further adding to the market expan
The Europe Power over Ethernet Chipsets Market would witness market growth of 10% CAGR during the forecast period (2018 ? 2024). Favorable regulatory frameworks in European Union are further adding to the market expansion in the European region. European countries such as the U.K., Spain, and France would register a higher CAGR than other countries in the region during the forecast period. Technological advancements and pricings are the two factors that would make PoE?s a successful controls option, eventually. The popularity is evidenced by the growing momentum of PoE via large network gear providers and VARS. Based on the type, the Power over Ethernet Chipsets market is segmented into PoE Power Sourcing Equipment Chipset and PoE Powered Devices Chipset. Based on the device type, the market is segmented into VoIP Phone, Wireless Radio Access Point, Proximity Sensor, Network Cameras, Ethernet Switch & Injector and Others. The Applications highlighted in this report include Connectivity, LED Lighting, Infotainment, Security, and Others. Based on Deployment Type, the market is segmented into Cloud based and On-Premise. The end users covered under the report include Commercial and Industrial & Residential. The commercial segment is further segmented into Office Buildings & Small Offices, Hospitality, Retail and Healthcare. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe. The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include STMicroelectronics N.V., Silicon Laboratories, Inc., On Semiconductor, Maxim Integrated Products, Inc., Microchip Technology Incorporated, Texas Instruments incorporated, Robert Bosch GmbH, NXP Semiconductor N.V., Microsemi Corporation, and Honeywell International, Inc.