LAMEA 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Country and Growth Forecast, 2023 - 2029

The Latin America, Middle East and Africa 3D IC and 2.5D IC Packaging Market would witness market growth of 13.7% CAGR during the forecast period (2023-2029).

One of the biggest market prospects is the growing use of high-end computing, data centers, and servers, as well as the shrinking of IoT devices. Electrical equipment miniaturization has emerged as a prominent market trend. Small, portable, modern, compact electronic devices are becoming increasingly well-liked across the region, particularly among millennials. The 3D IC package is an essential component of these cutting-edge micro-electrical devices. As a consequence, their rising sales quickly reflect the general expansion of the market.

Businesses are seeking to push the envelope by creating cutting-edge technologies like 3D IC and 2.5D IC as the need for silicon wafers increases. As a result, there is a growing demand for really cutting-edge technology all across the region. Because of this, businesses spend a lot of money on R&D, focusing mostly on the development of products, which is good for the market. Long-standing companies in the 2.5D and 3D IC industries are attempting to develop updated, better versions of these parts.

The consumer electronics sector also expands throughout Latin America, particularly due to the region's increased reliance on wireless networking features. Furthermore, the necessary uses of integrated circuits in manufacturing are being accelerated by the increased R&D spending in consumer electronics and technological breakthroughs, as well as the growing popularity of wearable technology. In addition, trends like IoT connectivity, AI and ML applications in smart devices, as well as industrial automation are boosting semiconductor demand. Thus, the development and growth of the regional market are being driven by the growth of telecommunication, consumer electronics, and automation applications in various industries in the region.

The Brazil market dominated the LAMEA 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $1,510.7 Million by 2029. The Argentina market is experiencing a CAGR of 14.3% during (2023 - 2029). Additionally, The UAE market would witness a CAGR of 13.4% during (2023 - 2029).

Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

Free Valuable Insights: The Worldwide 3D IC and 2.5D IC Packaging Market is Projected to reach USD 83 Billion by 2029, at a CAGR of 10.1%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.

Scope of the Study

Market Segments Covered in the Report:

By Packaging Technology

• 2.5D
• 3D wafer-level chip-scale packaging (WLCSP)
• 3D Through-silicon via (TSV)

By End User

• Consumer Electronics
• Automotive
• Industrial
• Military & Aerospace
• Telecommunications
• Medical Devices & Others

By Application

• Memory
• Imaging & Optoelectronics
• MEMS/Sensors
• Logic
• LED
• Others

By Country

• Brazil
• Argentina
• UAE
• Saudi Arabia
• South Africa
• Nigeria
• Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company Limited
• Intel Corporation
• ASE Group (ASE Technology Holding Co., Ltd.)
• Amkor Technology, Inc.
• Broadcom, Inc.
• Texas Instruments, Inc.
• JCET Group
• Powertech Technology, Inc.
• United Microelectronics Corporation

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA 3D IC and 2.5D IC Packaging Market, by Packaging Technology
1.4.2 LAMEA 3D IC and 2.5D IC Packaging Market, by End User
1.4.3 LAMEA 3D IC and 2.5D IC Packaging Market, by Application
1.4.4 LAMEA 3D IC and 2.5D IC Packaging Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis – Global
3.1 Market Share Analysis, 2022

Chapter 4. LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology
4.1 LAMEA 2.5D Market by Country
4.2 LAMEA 3D wafer-level chip-scale packaging (WLCSP) Market by Country
4.3 LAMEA 3D Through-silicon via (TSV) Market by Country

Chapter 5. LAMEA 3D IC and 2.5D IC Packaging Market by End User
5.1 LAMEA Consumer Electronics Market by Country
5.2 LAMEA Automotive Market by Country
5.3 LAMEA Industrial Market by Country
5.4 LAMEA Military & Aerospace Market by Country
5.5 LAMEA Telecommunications Market by Country
5.6 LAMEA Others Market by Country

Chapter 6. LAMEA 3D IC and 2.5D IC Packaging Market by Application
6.1 LAMEA Memory Market by Country
6.2 LAMEA Imaging & Optoelectronics Market by Country
6.3 LAMEA MEMS/Sensors Market by Country
6.4 LAMEA Logic Market by Country
6.5 LAMEA LED Market by Country
6.6 LAMEA Others Market by Country

Chapter 7. LAMEA 3D IC and 2.5D IC Packaging Market by Country
7.1 Brazil 3D IC and 2.5D IC Packaging Market
7.1.1 Brazil 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.2 Brazil 3D IC and 2.5D IC Packaging Market by End User
7.1.3 Brazil 3D IC and 2.5D IC Packaging Market by Application
7.2 Argentina 3D IC and 2.5D IC Packaging Market
7.2.1 Argentina 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.2 Argentina 3D IC and 2.5D IC Packaging Market by End User
7.2.3 Argentina 3D IC and 2.5D IC Packaging Market by Application
7.3 UAE 3D IC and 2.5D IC Packaging Market
7.3.1 UAE 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.2 UAE 3D IC and 2.5D IC Packaging Market by End User
7.3.3 UAE 3D IC and 2.5D IC Packaging Market by Application
7.4 Saudi Arabia 3D IC and 2.5D IC Packaging Market
7.4.1 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.2 Saudi Arabia 3D IC and 2.5D IC Packaging Market by End User
7.4.3 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Application
7.5 South Africa 3D IC and 2.5D IC Packaging Market
7.5.1 South Africa 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.5.2 South Africa 3D IC and 2.5D IC Packaging Market by End User
7.5.3 South Africa 3D IC and 2.5D IC Packaging Market by Application
7.6 Nigeria 3D IC and 2.5D IC Packaging Market
7.6.1 Nigeria 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.6.2 Nigeria 3D IC and 2.5D IC Packaging Market by End User
7.6.3 Nigeria 3D IC and 2.5D IC Packaging Market by Application
7.7 Rest of LAMEA 3D IC and 2.5D IC Packaging Market
7.7.1 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.7.2 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by End User
7.7.3 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Application

Chapter 8. Company Profiles
8.1 Samsung Electronics Co., Ltd. (Samsung Group)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.6 SWOT Analysis
8.2 Taiwan Semiconductor Manufacturing Company Limited
8.2.1 Company overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expenses
8.3 Intel Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expenses
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding Co., Ltd.)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Research & Development Expense
8.5.4 Recent strategies and developments:
8.5.4.1 Partnerships, Collaborations, and Agreements:
8.6 Broadcom, Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 SWOT Analysis
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. United Microelectronics Corporation
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Regional Analysis
8.10.4 Research & Development Expenses

TABLE 1 LAMEA 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 2 LAMEA 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 3 LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 4 LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 5 LAMEA 2.5D Market by Country, 2019 - 2022, USD Million
TABLE 6 LAMEA 2.5D Market by Country, 2023 - 2029, USD Million
TABLE 7 LAMEA 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2019 - 2022, USD Million
TABLE 8 LAMEA 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2023 - 2029, USD Million
TABLE 9 LAMEA 3D Through-silicon via (TSV) Market by Country, 2019 - 2022, USD Million
TABLE 10 LAMEA 3D Through-silicon via (TSV) Market by Country, 2023 - 2029, USD Million
TABLE 11 LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 12 LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 13 LAMEA Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 14 LAMEA Consumer Electronics Market by Country, 2023 - 2029, USD Million
TABLE 15 LAMEA Automotive Market by Country, 2019 - 2022, USD Million
TABLE 16 LAMEA Automotive Market by Country, 2023 - 2029, USD Million
TABLE 17 LAMEA Industrial Market by Country, 2019 - 2022, USD Million
TABLE 18 LAMEA Industrial Market by Country, 2023 - 2029, USD Million
TABLE 19 LAMEA Military & Aerospace Market by Country, 2019 - 2022, USD Million
TABLE 20 LAMEA Military & Aerospace Market by Country, 2023 - 2029, USD Million
TABLE 21 LAMEA Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 22 LAMEA Telecommunications Market by Country, 2023 - 2029, USD Million
TABLE 23 LAMEA Others Market by Country, 2019 - 2022, USD Million
TABLE 24 LAMEA Others Market by Country, 2023 - 2029, USD Million
TABLE 25 LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 26 LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 27 LAMEA Memory Market by Country, 2019 - 2022, USD Million
TABLE 28 LAMEA Memory Market by Country, 2023 - 2029, USD Million
TABLE 29 LAMEA Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 30 LAMEA Imaging & Optoelectronics Market by Country, 2023 - 2029, USD Million
TABLE 31 LAMEA MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 32 LAMEA MEMS/Sensors Market by Country, 2023 - 2029, USD Million
TABLE 33 LAMEA Logic Market by Country, 2019 - 2022, USD Million
TABLE 34 LAMEA Logic Market by Country, 2023 - 2029, USD Million
TABLE 35 LAMEA LED Market by Country, 2019 - 2022, USD Million
TABLE 36 LAMEA LED Market by Country, 2023 - 2029, USD Million
TABLE 37 LAMEA Others Market by Country, 2019 - 2022, USD Million
TABLE 38 LAMEA Others Market by Country, 2023 - 2029, USD Million
TABLE 39 LAMEA 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2022, USD Million
TABLE 40 LAMEA 3D IC and 2.5D IC Packaging Market by Country, 2023 - 2029, USD Million
TABLE 41 Brazil 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 42 Brazil 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 43 Brazil 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 44 Brazil 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 45 Brazil 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 46 Brazil 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 47 Brazil 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 48 Brazil 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 49 Argentina 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 50 Argentina 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 51 Argentina 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 52 Argentina 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 53 Argentina 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 54 Argentina 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 55 Argentina 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 56 Argentina 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 57 UAE 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 58 UAE 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 59 UAE 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 60 UAE 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 61 UAE 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 62 UAE 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 63 UAE 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 64 UAE 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 65 Saudi Arabia 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 66 Saudi Arabia 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 67 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 68 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 69 Saudi Arabia 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 70 Saudi Arabia 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 71 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 72 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 73 South Africa 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 74 South Africa 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 75 South Africa 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 76 South Africa 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 77 South Africa 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 78 South Africa 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 79 South Africa 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 80 South Africa 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 81 Nigeria 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 82 Nigeria 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 83 Nigeria 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 84 Nigeria 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 85 Nigeria 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 86 Nigeria 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 87 Nigeria 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 88 Nigeria 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 89 Rest of LAMEA 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 90 Rest of LAMEA 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 91 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 92 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 93 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 94 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 95 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 96 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 97 Key Information – Samsung Electronics Co., Ltd.
TABLE 98 Key Information– Taiwan Semiconductor Manufacturing Company Limited
TABLE 99 Key Information – Intel Corporation
TABLE 100 Key Information – ASE Group
TABLE 101 Key Information – Amkor Technology, Inc.
TABLE 102 Key Information – Broadcom, Inc.
TABLE 103 Key Information – Texas Instruments, Inc.
TABLE 104 Key Information – JCET Group
TABLE 105 Key Information – Powertech Technology Inc.
TABLE 106 Key Information – United Microelectronics Corporation

List of Figures
FIG 1 Methodology for the research
FIG 2 Market Share Analysis, 2022
FIG 3 LAMEA 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2022
FIG 4 LAMEA 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2029
FIG 5 LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2029, USD Million
FIG 6 LAMEA 3D IC and 2.5D IC Packaging Market share by End User, 2022
FIG 7 LAMEA 3D IC and 2.5D IC Packaging Market share by End User, 2029
FIG 8 LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2029, USD Million
FIG 9 LAMEA 3D IC and 2.5D IC Packaging Market share by Application, 2022
FIG 10 LAMEA 3D IC and 2.5D IC Packaging Market share by Application, 2029
FIG 11 LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2029, USD Million
FIG 12 LAMEA 3D IC and 2.5D IC Packaging Market share by Country, 2022
FIG 13 LAMEA 3D IC and 2.5D IC Packaging Market share by Country, 2029
FIG 14 LAMEA 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2029, USD Million
FIG 15 SWOT Analysis: Samsung Electronics CO. Ltd.
FIG 16 SWOT analysis: Intel corporation
FIG 17 SWOT Analysis: Broadcom, Inc.