The Latin America, Middle East and Africa Flip Chip Market would witness market growth of 10.2% CAGR during the forecast period (2020-2026). The Flip Chip, also known as the Controlled Collapse Chip Connection (C4), consists of conductive bumps mounted on the sensor pads on the surface of the wafer, accompanied by the mounting of semiconductor devices by flipping the part. The use of flip chip has increased in the electronics industry due to its numerous advantages, such as lower cost, high packaging capacity, improved circuit durability and compact dimensions. As a result, the rise in demand for smart electronics across the globe is a major factor projected to fuel the development of the global market size of the flip chip during the forecast period.
Compared to conventional wire-bond packaging, flip chip offers a variety of advantages, such as superior thermal and electrical efficiency, stability in the substrate for varying performance requirements, remarkable I/O capacity, reduced form factors and well-established process equipment experience. Gold bumping technology contributes the second largest portion of the overall flip chip market. The gold bumping market is projected to see sluggish growth relative to other bumping technologies due to its high production costs, fragile construction, and complexities involved in the bumping phase. In addition, improved heat dissipation of ball grid style flip chips provides them an acceptable option for applications where smaller size chips are desired without the need for an external heat sink.
The growing in demand for high-speed and portable electronic products has accelerated the adoption of flip chip technology in the electronics industry. The Internet of Things (IoT) has gained attention and is a key driver in the market. Items used in IoT, such as sensors & actuators, analog & mixed-signal translators, and microcontrollers or embedded processors, need effective and reliable packaging solutions that can be produced using flip chips.
Based on Packaging Technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Based on Bumping Technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Based on End User, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
Free Valuable Insights: Flip Chip Market in LAMEA is expected to register a CAGR of 10.2% during the forecast period (2020-2026)
The market research report covers theanalysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
Scope of the LAMEA Flip Chip Market Analysis
Market Segmentation:
By Packaging Technology
By Bumping Technology
- Copper Pillar
- Gold Bumping
- Solder Bumping
- Others
By End-User
- Electronics
- Industrial
- IT & Telecom
- Automotive
- Healthcare & Life Sciences
- Aerospace & Defense
- Others
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Companies Profiled
- 3M Company
- Advanced Micro Devices, Inc.
- Amkor Technology, Inc.
- Apple, Inc.
- Fujitsu Limited
- Intel Corporation
- IBM Corporation
- Samsung Electronics Co., Ltd.
- Texas Instruments, Inc.
- Taiwan Semiconductor Manufacturing Company
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Latin America, Middle East and Africa (LAMEA) Flip Chip Market, by Packaging Technology
1.4.2 Latin America, Middle East and Africa (LAMEA) Flip Chip Market, by Bumping Technology
1.4.3 Latin America, Middle East and Africa (LAMEA) Flip Chip Market, by End User
1.4.4 Latin America, Middle East and Africa (LAMEA) Flip Chip Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. LAMEA Flip Chip Market by Packaging Technology
3.1 LAMEA Flip Chip 2.5D IC Market by Country
3.2 LAMEA Flip Chip 3D IC Market by Country
3.3 LAMEA Flip Chip 2D IC Market by Country
Chapter 4. LAMEA Flip Chip Market by Bumping Technology
4.1 LAMEA Copper Pillar Flip Chip Market by Country
4.2 LAMEA Gold Bumping Flip Chip Market by Country
4.3 LAMEA Solder Bumping Flip Chip Market by Country
4.4 LAMEA Other Bumping Technology Flip Chip Market by Country
Chapter 5. LAMEA Flip Chip Market by End User
5.1 LAMEA Electronics Flip Chip Market by Country
5.2 LAMEA Industrial Flip Chip Market by Country
5.3 LAMEA IT & Telecom Flip Chip Market by Country
5.4 LAMEA Automotive Flip Chip Market by Country
5.5 LAMEA Healthcare & Life Sciences Flip Chip Market by Country
5.6 LAMEA Aerospace & Defense Flip Chip Market by Country
5.7 LAMEA Others Flip Chip Market by Country
Chapter 6. LAMEA Flip Chip Market by Country
6.1 Brazil Flip Chip Market
6.1.1 Brazil Flip Chip Market by Packaging Technology
6.1.2 Brazil Flip Chip Market by Bumping Technology
6.1.3 Brazil Flip Chip Market by End User
6.2 Argentina Flip Chip Market
6.2.1 Argentina Flip Chip Market by Packaging Technology
6.2.2 Argentina Flip Chip Market by Bumping Technology
6.2.3 Argentina Flip Chip Market by End User
6.3 UAE Flip Chip Market
6.3.1 UAE Flip Chip Market by Packaging Technology
6.3.2 UAE Flip Chip Market by Bumping Technology
6.3.3 UAE Flip Chip Market by End User
6.4 Saudi Arabia Flip Chip Market
6.4.1 Saudi Arabia Flip Chip Market by Packaging Technology
6.4.2 Saudi Arabia Flip Chip Market by Bumping Technology
6.4.3 Saudi Arabia Flip Chip Market by End User
6.5 South Africa Flip Chip Market
6.5.1 South Africa Flip Chip Market by Packaging Technology
6.5.2 South Africa Flip Chip Market by Bumping Technology
6.5.3 South Africa Flip Chip Market by End User
6.6 Nigeria Flip Chip Market
6.6.1 Nigeria Flip Chip Market by Packaging Technology
6.6.2 Nigeria Flip Chip Market by Bumping Technology
6.6.3 Nigeria Flip Chip Market by End User
6.7 Rest of LAMEA Flip Chip Market
6.7.1 Rest of LAMEA Flip Chip Market by Packaging Technology
6.7.2 Rest of LAMEA Flip Chip Market by Bumping Technology
6.7.3 Rest of LAMEA Flip Chip Market by End User
Chapter 7. Company Profiles
7.1 3M Company
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Advanced Micro Devices, Inc.
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expenses
7.3 Amkor Technology, Inc.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.4 Apple, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Product and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 SWOT Analysis
7.5 Fujitsu Limited
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 SWOT Analysis
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 IBM Corporation
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Regional & Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Samsung Electronics Co., Ltd. (Samsung Group)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Texas Instruments, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 SWOT Analysis
7.1 Taiwan Semiconductor Manufacturing Company
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
TABLE 1 LAMEA Flip Chip Market, 2016 - 2019, USD Million
TABLE 2 LAMEA Flip Chip Market, 2020 - 2026, USD Million
TABLE 3 LAMEA Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 4 LAMEA Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 5 LAMEA Flip Chip 2.5D IC Market by Country, 2016 - 2019, USD Million
TABLE 6 LAMEA Flip Chip 2.5D IC Market by Country, 2020 - 2026, USD Million
TABLE 7 LAMEA Flip Chip 3D IC Market by Country, 2016 - 2019, USD Million
TABLE 8 LAMEA Flip Chip 3D IC Market by Country, 2020 - 2026, USD Million
TABLE 9 LAMEA Flip Chip 2D IC Market by Country, 2016 - 2019, USD Million
TABLE 10 LAMEA Flip Chip 2D IC Market by Country, 2020 - 2026, USD Million
TABLE 11 LAMEA Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 12 LAMEA Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 13 LAMEA Copper Pillar Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 14 LAMEA Copper Pillar Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 15 LAMEA Gold Bumping Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 16 LAMEA Gold Bumping Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 17 LAMEA Solder Bumping Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 18 LAMEA Solder Bumping Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 19 LAMEA Other Bumping Technology Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 20 LAMEA Other Bumping Technology Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 21 LAMEA Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 22 LAMEA Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 23 LAMEA Electronics Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 24 LAMEA Electronics Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 25 LAMEA Industrial Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 26 LAMEA Industrial Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 27 LAMEA IT & Telecom Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 28 LAMEA IT & Telecom Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 29 LAMEA Automotive Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 30 LAMEA Automotive Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 31 LAMEA Healthcare & Life Sciences Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 32 LAMEA Healthcare & Life Sciences Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 33 LAMEA Aerospace & Defense Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 34 LAMEA Aerospace & Defense Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 35 LAMEA Others Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 36 LAMEA Others Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 37 LAMEA Flip Chip Market by Country, 2016 - 2019, USD Million
TABLE 38 LAMEA Flip Chip Market by Country, 2020 - 2026, USD Million
TABLE 39 Brazil Flip Chip Market, 2016 - 2019, USD Million
TABLE 40 Brazil Flip Chip Market, 2020 - 2026, USD Million
TABLE 41 Brazil Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 42 Brazil Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 43 Brazil Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 44 Brazil Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 45 Brazil Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 46 Brazil Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 47 Argentina Flip Chip Market, 2016 - 2019, USD Million
TABLE 48 Argentina Flip Chip Market, 2020 - 2026, USD Million
TABLE 49 Argentina Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 50 Argentina Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 51 Argentina Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 52 Argentina Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 53 Argentina Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 54 Argentina Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 55 UAE Flip Chip Market, 2016 - 2019, USD Million
TABLE 56 UAE Flip Chip Market, 2020 - 2026, USD Million
TABLE 57 UAE Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 58 UAE Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 59 UAE Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 60 UAE Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 61 UAE Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 62 UAE Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 63 Saudi Arabia Flip Chip Market, 2016 - 2019, USD Million
TABLE 64 Saudi Arabia Flip Chip Market, 2020 - 2026, USD Million
TABLE 65 Saudi Arabia Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 66 Saudi Arabia Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 67 Saudi Arabia Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 68 Saudi Arabia Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 69 Saudi Arabia Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 70 Saudi Arabia Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 71 South Africa Flip Chip Market, 2016 - 2019, USD Million
TABLE 72 South Africa Flip Chip Market, 2020 - 2026, USD Million
TABLE 73 South Africa Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 74 South Africa Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 75 South Africa Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 76 South Africa Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 77 South Africa Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 78 South Africa Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 79 Nigeria Flip Chip Market, 2016 - 2019, USD Million
TABLE 80 Nigeria Flip Chip Market, 2020 - 2026, USD Million
TABLE 81 Nigeria Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 82 Nigeria Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 83 Nigeria Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 84 Nigeria Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 85 Nigeria Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 86 Nigeria Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 87 Rest of LAMEA Flip Chip Market, 2016 - 2019, USD Million
TABLE 88 Rest of LAMEA Flip Chip Market, 2020 - 2026, USD Million
TABLE 89 Rest of LAMEA Flip Chip Market by Packaging Technology, 2016 - 2019, USD Million
TABLE 90 Rest of LAMEA Flip Chip Market by Packaging Technology, 2020 - 2026, USD Million
TABLE 91 Rest of LAMEA Flip Chip Market by Bumping Technology, 2016 - 2019, USD Million
TABLE 92 Rest of LAMEA Flip Chip Market by Bumping Technology, 2020 - 2026, USD Million
TABLE 93 Rest of LAMEA Flip Chip Market by End User, 2016 - 2019, USD Million
TABLE 94 Rest of LAMEA Flip Chip Market by End User, 2020 - 2026, USD Million
TABLE 95 Key Information – 3M Company
TABLE 96 Key information – Advanced Micro Devices, Inc.
TABLE 97 Key Information – Amkor Technology, Inc.
TABLE 98 Key Information – Apple, Inc.
TABLE 99 Key Information – Fujitsu Limited
TABLE 100 Key Information – Intel Corporation
TABLE 101 Key information – IBM Corporation
TABLE 102 Key Information –Samsung Electronics Co., Ltd.
TABLE 103 Key Information – Texas Instruments, Inc.
TABLE 104 Key Information–Taiwan Semiconductor Manufacturing Company
List of Figures
FIG 1 Methodology for the research
FIG 2 SWOT Analysis: 3M Company
FIG 3 SWOT Analysis: apple, Inc.
FIG 4 SWOT Analysis: Fujitsu Limited
FIG 5 SWOT analysis: Intel corporation
FIG 6 Swot analysis: IBM Corporation
FIG 7 SWOT Analysis: Samsung Electronics CO. Ltd.
FIG 8 SWOT Analysis: Texas Instruments, Inc.