The Latin America, Middle East and Africa Integrated Passive Devices Market would witness market growth of 13.6% CAGR during the forecast period (2022-2028).
Additionally, it is anticipated that the market for integrated passive devices would expand due to the use of specially built IPD in specialized and niche applications like GPS tracking and cellular encryption. Thin film products are anticipated to be the benchmarks for next-generation technology in terms of materials because they allow for better densities and fewer losses. The potential for extensive commercialization has expanded as a result of the development of advanced packaging techniques and cost-effective IPD.
Integrated passive devices (IPDs) can be stacked built on top of another bare die or chip in a third dimension (3D) with active integrated circuits or other IPDs in an electronic system assembly. Integrated passives frequently use SIL, SIP, or any other electronic packaging package (such as DIL, DIP, QFN, chip-scale package/CSP, wafer level package/WLP, etc.). Integrated passives can be employed in hybrid, multi-chip, or chiplet modules and implementations by acting as a module substrate.
IPD substrates include glass, and silicon-coated in a dielectric layer like silicon dioxide, ceramic, layered ceramic, and ceramic. The substrate may also be flexible, such as a laminate made of FR4 or a related polyimide, Kapton, or any other suitable polyimide. It may be rigid, such as a package also known as an active interposer. It is possible to disregard or be aware of how the substrate and prospective packaging may affect the performance of IPDs, which is advantageous for the design of an electronic system.
Integrated passive devices provide many advantages, including smaller package footprints, higher performance, simpler interconnections, greater reliability, and enhanced component tolerance and output. The adoption of incorporated passive devices in IoT and AI-enabled products, smart consumer wearables, vehicle infotainment, and navigation systems will be accelerated by these capabilities. The market for integrated passive devices will grow due to IPD integration's assistance in lowering system costs and attaining the necessary small-footprint packaging for automobile and consumer electronics devices.
The United Arab Emirates (UAE) is one of the Middle East's most economically developed and diverse marketplaces, and it also has a strong healthcare system. The UAE government has prioritized developing world-class healthcare infrastructure, and as a result, the sector has grown and developed significantly over the past few years. A third of people in the UAE have diabetes, and one in five are obese, according to the World Health Organization. As the prevalence of lifestyle diseases rises, these individuals—supported by relatively high-income levels will require higher quality healthcare.
The Brazil market dominated the LAMEA Integrated Passive Devices Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $71.8 Million by 2028.The Argentina market is experiencing a CAGR of 14.2% during (2022 - 2028). Additionally, The UAE market would display a CAGR of 13.3% during (2022 - 2028).
Based on Application, the market is segmented into Electrostatic discharge/electromagnetic interference (ESD/EMI) Protection, Radio Frequency LED Lighting and Digital & Mixed-Signal. Based on End User, the market is segmented into Automotive, Consumer Electronics, Healthcare and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
Free Valuable Insights: The Global Integrated Passive Devices Market is Predict to reach $3.6 Billion by 2028, at a CAGR of 10.9%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include STMicroelectronics N.V., Infineon Technologies AG, Jiangsu Changjing Electronics Technology Co., Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ON Semiconductor Corporation, Murata Manufacturing Co., Ltd., Johanson Technology, Inc., and OnChip Devices, Inc.
By Application
By End User
By Country
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