Advanced Packaging Market in Europe would register a CAGR of 12.3% during 2020-2026

According to a new report Europe Advanced Packaging Market, published by KBV research, the Europe Advanced Packaging Market would witness market growth of 12.3% CAGR during the forecast period (2020-2026).

The Germany market is among the top revenue generating regions within the Europe Aerospace & Defense Advanced Packaging Market by Country 2019, growing at a CAGR of 13.4 % during the forecast period. The UK market is experiencing a CAGR of 13.8% during (2020 - 2026). Additionally, The France market is anticipated to grow at a CAGR of 15.4% during (2020 - 2026).

The Flip-Chip Ball Grid Array market dominated the France Advanced Packaging Market by Type 2019, growing at a CAGR of 11.8 % during the forecast period. The Flip Chip CSP market is exhibiting a CAGR of 12.4% during (2020 - 2026). Additionally, The Wafer Level CSP market is witnessing CAGR of 14% during (2020 - 2026).

The Consumer Electronics market dominated the Spain Advanced Packaging Market by End User 2019, thereby, achieving a market value of $330.5 million by 2026. The Automotive market is expected to grow at a CAGR of 14.7% during (2020 - 2026). The Industrial market would showcase a CAGR of 15.8% during (2020 - 2026). Additionally, The Aerospace & Defense market is expected to witness CAGR of 16.5% during (2020 - 2026).

Structural Insights: https://www.kbvresearch.com/europe-advanced-packaging-market/

The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.

Europe Advanced Packaging Market Segmentation

By Type

• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 5D/3D
• Others

By End-User

• Consumer Electronics
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare & Life Sciences
• Others

By Country

• Germany Advanced Packaging Market
• UK Advanced Packaging Market
• France Advanced Packaging Market
• Russia Advanced Packaging Market
• Spain Advanced Packaging Market
• Italy Advanced Packaging Market
• Rest of Europe Advanced Packaging Market

Companies Profiled

• Qualcomm, Inc.
• Intel Corporation
• IBM Corporation
• Texas Instruments, Inc.
• Analog Devices, Inc.
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd. (Samsung Group)
• Amkor Technology, Inc.
• Brewer Science, Inc.
• Microchip Technology, Inc.

Unique Offerings from KBV Research

• Exhaustive coverage
• Highest number of market tables and figures
• Subscription based model available
• Guaranteed best price
• Assured post sales research support with 10% customization free

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