According to a new report Global Flip Chip Market, published by KBV research, The Global Flip Chip Market size is expected to reach $36.7 billion by 2026, rising at a market growth of 8.2% CAGR during the forecast period.
The solder bumping technology segment has a large market share in the global flip chip market. This is attributable to the low cost of solder bumping technologies and significantly improved bonding efficiency. The rapid decline in tin-lead eutectic solder is related to the collective opposition to the usage in lead around the globe owing to its serious environmental threat.
The 2.5D IC market dominated the Global Flip Chip Market by Packaging Technology 2019. 2.5D IC packaging technology faces a range of problems, such as the shortage of foundries and manufacturing plants supported by 3D IC packaging technology. The 2D IC market is expected to witness a CAGR of 8.5% during (2020 - 2026).
North America is a prominent region in the market for flip chip technology owing to the involvement of a number of key players in the region. In addition, strong investment in research and development of flip-chip technology is also expected to fuel demand growth in the coming years. Europe is projected to see substantial growth in the flip-chip industry owing to the usage of flip-chip technology in consumer electronics and shipping in the area. Asia Pacific is projected to lead the global flip chip industry with the presence of major production centers in emerging economies such as India and China, which are anticipated to provide significant market growth opportunities.
Structural Insights: https://www.kbvresearch.com/flip-chip-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company.
By Packaging Technology
By Bumping Technology
By End-User
By Geography
Companies Profiled
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