“Global Next Generation Non-Volatile Memory Market to reach a market value of USD 18.6 Billion by 2031 growing at a CAGR of 17.3%”
The Global Next Generation Non-Volatile Memory Market size is expected to reach $18.6 billion by 2031, rising at a market growth of 17.3% CAGR during the forecast period.
Premium consumer electronics, such as high-definition cameras and advanced gaming consoles, require memory that supports high data throughput and rapid access. As consumer electronics become more compact and lightweight, there is a need for memory solutions that fit within smaller device designs. Therefore, in 2023, the Consumer Electronics segment held 1/5th revenue share in the market. Next generation NVM technologies can provide high-density storage in compact form factors, enabling slimmer and more portable devices without sacrificing performance. Next generation NVM offers the performance needed to handle these high-end features effectively.
The amount of data generated globally is increasing at an unprecedented rate due to the proliferation of digital devices, IoT sensors, and data-driven applications. This surge in data creates a need for more efficient and larger storage solutions. There is a growing shift towards data-centric computing architectures, where storage and memory are optimized to handle massive data loads efficiently. With the increasing importance of data security and durability, next generation NVMs offer enhanced data protection features. Therefore, increasing data storage requirements is driving the growth of the market.
Moreover, as data processing needs evolve, the complexity of data tasks grows. High-speed data processing requires memory solutions that can handle complex data operations efficiently. Next generation NVMs are integral to these architectures, offering enhanced performance that aligns with the evolving demands of computing technologies. In conclusion, the rising demand for high-speed data processing propels the market's growth.
However, Existing systems and infrastructure may be built around older memory technologies with different interfaces and protocols. Integrating new NVM technologies often requires modifications or updates to existing systems to ensure compatibility, which can be complex and costly. Next generation NVM technologies may use new or proprietary interfaces that are not standardized across the industry. Ensuring these new interfaces work seamlessly with existing hardware and software systems can be challenging and may require additional development or adaptation. Hence, integration with existing systems is impeding the growth of the market.
The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Acquisitions, and Partnerships & Collaborations.
Based on type, the next generation non-volatile memory market is divided into high-bandwidth memory (HBM) and hybrid memory cube (HMC). In 2023, the high-bandwidth memory (HBM) segment garnered 58% revenue share in the next generation non-volatile memory market. Next generation non-volatile memory technologies, such as 3D XPoint, MRAM, and ReRAM, are designed to deliver faster data access and higher performance compared to traditional memory types.
On the basis of wafer size, the market is segmented into 300 mm and 200 mm. In 2023, the 200 mm segment attained 40% revenue share in the market. 200 mm wafer fabs are often more affordable to set up and operate. This lower capital expenditure makes it easier for these companies to enter the market and contribute to the supply of next generation NVM technologies. 200 mm wafer fabs can be more adaptable to changes in technology and production needs.
By application, the market is divided into BFSI, information technology, consumer electronics, telecommunications, government, and others. In 2023, the BFSI segment registered 22% revenue share in the market. Security is a top priority in the BFSI sector due to the sensitive nature of financial data. Next generation NVM offers advanced encryption and data protection features that help safeguard against unauthorized access and data breaches, ensuring compliance with stringent regulatory requirements.
Free Valuable Insights: Global Next Generation Non-Volatile Memory Market size to reach USD 18.6 Billion by 2031
Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific region witnessed 39% revenue share in the market in 2023. Asia-Pacific is home to leading technology and electronics manufacturers at the forefront of adopting and developing next generation technologies. Countries like China, South Korea, and Japan are major hubs for innovation in consumer electronics, computing, and telecommunications, driving the demand for advanced NVM solutions.
| Report Attribute | Details |
|---|---|
| Market size value in 2023 | USD 5.3 Billion |
| Market size forecast in 2031 | USD 18.6 Billion |
| Base Year | 2023 |
| Historical Period | 2020 to 2022 |
| Forecast Period | 2024 to 2031 |
| Revenue Growth Rate | CAGR of 17.3% from 2024 to 2031 |
| Number of Pages | 253 |
| Number of Tables | 360 |
| Report coverage | Market Trends, Revenue Estimation and Forecast, Segmentation Analysis, Market Share Analysis, Regional and Country Breakdown, Porter’s 5 Forces Analysis, Company Profiling, Companies Strategic Developments, SWOT Analysis, Winning Imperatives |
| Segments covered | Type, Wafer Size, Application, Region |
| Country scope |
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| Companies Included | Samsung Electronics Co. Ltd, Micron Technology, Inc., Fujitsu Limited, Honeywell International, Inc., Infineon Technologies AG, ROHM Co., Ltd., Toshiba International Corporation, Intel Corporation, Kingston Technology Company, Inc., Kioxia Holdings Corporation |
By Type
By Wafer Size
By Application
By Geography
This Market size is expected to reach $18.6 billion by 2031.
Increasing Data Storage Requirements are driving the Market in coming years, however, High cost of BSD systems restraints the growth of the Market.
Samsung Electronics Co. Ltd, Micron Technology, Inc., Fujitsu Limited, Honeywell International, Inc., Infineon Technologies AG, ROHM Co., Ltd., Toshiba International Corporation, Intel Corporation, Kingston Technology Company, Inc., Kioxia Holdings Corporation
The expected CAGR of this Market is 17.3% from 2024 to 2031.
The 300 mm segment is leading the Memory Market by Wafer Size in 2023; thereby, achieving a market value of $10.9 billion by 2031.
The Asia Pacific region dominated the Market by Region in 2023; thereby, achieving a market value of $7.5 billion by 2031.
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