The North America 3D IC and 2.5D IC Packaging Market would witness market growth of 9.4% CAGR during the forecast period (2023-2029).
When using a 2.5D construction, two or more functional semiconductor chips are stacked one on top of the other atop a silicon interposer to provide an incredibly high die-to-die connection density. For shorter connectivity and a smaller package footprint, active chips are incorporated into a 3D structure by stacking die. Due to their advantages in obtaining exceptionally high density of package and great energy efficiency, 2.5D & 3D have recently acquired popularity as appropriate chipset integration platforms.
The chip has a significant number of integrated tiny transistors as well as other electronic parts. This produces circuits that are factors of magnitude faster, cheaper, and smaller than those made of discrete components, enabling a high transistor density. Rapid implementation of standardized ICs in substituting designs employing discrete transistors has been made possible by the integrated circuit's mass production capability, dependability, and building-block method for IC design. ICs have changed the electronics industry and are now found in almost all electrical devices. Because of their compact size and low price, ICs like current microcontrollers and computer processors have allowed computers, mobile phones, and other home gadgets to become indispensable components of modern society.
Electric vehicles are receiving more attention from the market-leading automotive sector as a means of lowering vehicle emissions. Governments, as well as environmental organizations, are attempting to implement emission rules and laws in response to increasing concerns about the environment, which may increase the cost of producing electric drive trains and fuel-efficient engines in the coming years. In addition, the need for semiconductors is increasing due to the region's expanding automobile industry, which uses semiconductors mostly as equipment. Because of this, the market in the North American region is expected to grow rapidly in the years to come.
The US market dominated the North America 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $15,934.3 Million by 2029. The Canada market is poised to grow at a CAGR of 11.9% during (2023 - 2029). Additionally, The Mexico market would witness a CAGR of 10.9% during (2023 - 2029).
Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Worldwide 3D IC and 2.5D IC Packaging Market is Projected to reach USD 83 Billion by 2029, at a CAGR of 10.1%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Packaging Technology
- 2.5D
- 3D wafer-level chip-scale packaging (WLCSP)
- 3D Through-silicon via (TSV)
By End User
- Consumer Electronics
- Automotive
- Industrial
- Military & Aerospace
- Telecommunications
- Medical Devices & Others
By Application
- Memory
- Imaging & Optoelectronics
- MEMS/Sensors
- Logic
- LED
- Others
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Samsung Electronics Co., Ltd.
- Taiwan Semiconductor Manufacturing Company Limited
- Intel Corporation
- ASE Group (ASE Technology Holding Co., Ltd.)
- Amkor Technology, Inc.
- Broadcom, Inc.
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- United Microelectronics Corporation
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America 3D IC and 2.5D IC Packaging Market, by Packaging Technology
1.4.2 North America 3D IC and 2.5D IC Packaging Market, by End User
1.4.3 North America 3D IC and 2.5D IC Packaging Market, by Application
1.4.4 North America 3D IC and 2.5D IC Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis – Global
3.1 Market Share Analysis, 2022
Chapter 4. North America 3D IC and 2.5D IC Packaging Market by Packaging Technology
4.1 North America 2.5D Market by Country
4.2 North America 3D wafer-level chip-scale packaging (WLCSP) Market by Country
4.3 North America 3D Through-silicon via (TSV) Market by Country
Chapter 5. North America 3D IC and 2.5D IC Packaging Market by End User
5.1 North America Consumer Electronics Market by Country
5.2 North America Automotive Market by Country
5.3 North America Industrial Market by Country
5.4 North America Military & Aerospace Market by Country
5.5 North America Telecommunications Market by Country
5.6 North America Medical Devices & Others Market by Country
Chapter 6. North America 3D IC and 2.5D IC Packaging Market by Application
6.1 North America Memory Market by Country
6.2 North America Imaging & Optoelectronics Market by Country
6.3 North America MEMS/Sensors Market by Country
6.4 North America Logic Market by Country
6.5 North America LED Market by Country
6.6 North America Others Market by Country
Chapter 7. North America 3D IC and 2.5D IC Packaging Market by Country
7.1 US 3D IC and 2.5D IC Packaging Market
7.1.1 US 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.2 US 3D IC and 2.5D IC Packaging Market by End User
7.1.3 US 3D IC and 2.5D IC Packaging Market by Application
7.2 Canada 3D IC and 2.5D IC Packaging Market
7.2.1 Canada 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.2 Canada 3D IC and 2.5D IC Packaging Market by End User
7.2.3 Canada 3D IC and 2.5D IC Packaging Market by Application
7.3 Mexico 3D IC and 2.5D IC Packaging Market
7.3.1 Mexico 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.2 Mexico 3D IC and 2.5D IC Packaging Market by End User
7.3.3 Mexico 3D IC and 2.5D IC Packaging Market by Application
7.4 Rest of North America 3D IC and 2.5D IC Packaging Market
7.4.1 Rest of North America 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.2 Rest of North America 3D IC and 2.5D IC Packaging Market by End User
7.4.3 Rest of North America 3D IC and 2.5D IC Packaging Market by Application
Chapter 8. Company Profiles
8.1 Samsung Electronics Co., Ltd. (Samsung Group)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.6 SWOT Analysis
8.2 Taiwan Semiconductor Manufacturing Company Limited
8.2.1 Company overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expenses
8.3 Intel Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expenses
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding Co., Ltd.)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Research & Development Expense
8.5.4 Recent strategies and developments:
8.5.4.1 Partnerships, Collaborations, and Agreements:
8.6 Broadcom, Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 SWOT Analysis
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. United Microelectronics Corporation
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Regional Analysis
8.10.4 Research & Development Expenses
TABLE 1 North America 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 2 North America 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 3 North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 4 North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 5 North America 2.5D Market by Country, 2019 - 2022, USD Million
TABLE 6 North America 2.5D Market by Country, 2023 - 2029, USD Million
TABLE 7 North America 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2019 - 2022, USD Million
TABLE 8 North America 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2023 - 2029, USD Million
TABLE 9 North America 3D Through-silicon via (TSV) Market by Country, 2019 - 2022, USD Million
TABLE 10 North America 3D Through-silicon via (TSV) Market by Country, 2023 - 2029, USD Million
TABLE 11 North America 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 12 North America 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 13 North America Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 14 North America Consumer Electronics Market by Country, 2023 - 2029, USD Million
TABLE 15 North America Automotive Market by Country, 2019 - 2022, USD Million
TABLE 16 North America Automotive Market by Country, 2023 - 2029, USD Million
TABLE 17 North America Industrial Market by Country, 2019 - 2022, USD Million
TABLE 18 North America Industrial Market by Country, 2023 - 2029, USD Million
TABLE 19 North America Military & Aerospace Market by Country, 2019 - 2022, USD Million
TABLE 20 North America Military & Aerospace Market by Country, 2023 - 2029, USD Million
TABLE 21 North America Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 22 North America Telecommunications Market by Country, 2023 - 2029, USD Million
TABLE 23 North America Medical Devices & Others Market by Country, 2019 - 2022, USD Million
TABLE 24 North America Medical Devices & Others Market by Country, 2023 - 2029, USD Million
TABLE 25 North America 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 26 North America 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 27 North America Memory Market by Country, 2019 - 2022, USD Million
TABLE 28 North America Memory Market by Country, 2023 - 2029, USD Million
TABLE 29 North America Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 30 North America Imaging & Optoelectronics Market by Country, 2023 - 2029, USD Million
TABLE 31 North America MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 32 North America MEMS/Sensors Market by Country, 2023 - 2029, USD Million
TABLE 33 North America Logic Market by Country, 2019 - 2022, USD Million
TABLE 34 North America Logic Market by Country, 2023 - 2029, USD Million
TABLE 35 North America LED Market by Country, 2019 - 2022, USD Million
TABLE 36 North America LED Market by Country, 2023 - 2029, USD Million
TABLE 37 North America Others Market by Country, 2019 - 2022, USD Million
TABLE 38 North America Others Market by Country, 2023 - 2029, USD Million
TABLE 39 North America 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2022, USD Million
TABLE 40 North America 3D IC and 2.5D IC Packaging Market by Country, 2023 - 2029, USD Million
TABLE 41 US 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 42 US 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 43 US 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 44 US 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 45 US 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 46 US 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 47 US 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 48 US 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 49 Canada 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 50 Canada 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 51 Canada 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 52 Canada 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 53 Canada 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 54 Canada 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 55 Canada 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 56 Canada 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 57 Mexico 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 58 Mexico 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 59 Mexico 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 60 Mexico 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 61 Mexico 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 62 Mexico 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 63 Mexico 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 64 Mexico 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 65 Rest of North America 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 66 Rest of North America 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 67 Rest of North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 68 Rest of North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 69 Rest of North America 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 70 Rest of North America 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 71 Rest of North America 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 72 Rest of North America 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 73 Key Information – Samsung Electronics Co., Ltd.
TABLE 74 Key Information– Taiwan Semiconductor Manufacturing Company Limited
TABLE 75 Key Information – Intel Corporation
TABLE 76 Key Information – ASE Group
TABLE 77 Key Information – Amkor Technology, Inc.
TABLE 78 Key Information – Broadcom, Inc.
TABLE 79 Key Information – Texas Instruments, Inc.
TABLE 80 Key Information – JCET Group
TABLE 81 Key Information – Powertech Technology Inc.
TABLE 82 Key Information – United Microelectronics Corporation
List of Figures
FIG 1 Methodology for the research
FIG 2 Market Share Analysis, 2022
FIG 3 North America 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2022
FIG 4 North America 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2029
FIG 5 North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2029, USD Million
FIG 6 North America 3D IC and 2.5D IC Packaging Market share by End User, 2022
FIG 7 North America 3D IC and 2.5D IC Packaging Market share by End User, 2029
FIG 8 North America 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2029, USD Million
FIG 9 North America 3D IC and 2.5D IC Packaging Market share by Application, 2022
FIG 10 North America 3D IC and 2.5D IC Packaging Market share by Application, 2029
FIG 11 North America 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2029, USD Million
FIG 12 North America 3D IC and 2.5D IC Packaging Market share by Country, 2022
FIG 13 North America 3D IC and 2.5D IC Packaging Market share by Country, 2029
FIG 14 North America 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2029, USD Million
FIG 15 SWOT Analysis: Samsung Electronics CO. Ltd.
FIG 16 SWOT analysis: Intel corporation
FIG 17 SWOT Analysis: Broadcom, Inc.