The North America High-Density Interconnect (HDI) PCB Market would witness market growth of 10.2% CAGR during the forecast period (2023-2030).
The high-density interconnect (HDI) printed circuit boards (PCBs) boost the effectiveness of HDI boards in comparison to traditional PCBs while requiring fewer resources and boards in their construction. Additionally, these boards take less time to manufacture, which contributes to speedier production. The efficiency of the devices into which HDI boards are incorporated is increased by these functionalities. High efficiency, decreasing weight and size, and rising sales of consumer electronics are the main drivers of the market. These HDI PCBs have 400 m capture pads, 150 m smaller vias, and 100 m finer lines and gaps. Additionally, HDI PCBs have a connection pad density of over 20 pads/cm2, which is far higher than that of traditional PCBs.
In a number of end-use industries, such as communications, consumer electronics, and automotive, rising product demand is the main factor driving the market. The rapid product adoption of a variety of electronic products, including touch-screen gadgets, laptop computers, mobile phones, and digital cameras, can be credited to this. Additionally, the growing demand for high-performance devices and the trend toward miniaturizing electronic devices are boosting the market.
The evolution of mobile broadband services is being shaped by consumer expectations. There will be a need for creative solutions to address the anticipated increases in traffic (expected to be 10-100 times during the period of 2020–2030), a rise in the number of services and devices, as well as the desire for improved affordability and user experience. In any case, by the year 2025, there will be 50 billion connected gadgets on the Internet.
The region has a solid position in the market because top providers have boosted their investment in smart solutions for consumer electronics, IT, and telecom applications. The average American family, according to the US Environmental Protection Agency (EPA), employs 28 electronic gadgets, including e-readers, mobile phones, televisions, and personal computers. With the steady flood of new electronic devices, the demand for HDI PCBs will unavoidably increase. The average age of all Canadians was 41.1 years old, and there are seven million people who are over 65. Therefore, with the increasing need for HDIs for medical devices and consumer electronics, the region offers strong growth prospects to the market.
The US market dominated the North America High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $5,345.9 million by 2029. The Canada market is experiencing a CAGR of 12.7% during (2023 - 2030). Additionally, The Mexico market would exhibit a CAGR of 11.7% during (2023 - 2030).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Worldwide High-Density Interconnect (HDI) PCB Market is Projected to reach USD 26.9 Billion by 2030, at a CAGR of 10.9%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Automotive
- Industrial Electronics
- IT & Telecommunications
- Others
By Application
- Smartphone & Tablet
- PC & Laptop
- Smart Wearables
- Others
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- MEIKO ELECTRONICS CO., LTD.
- DAP CORPORATION
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Unitech Printed Circuit Board Corp.
- FICT LIMITED (Fujitsu Limited)
- TTM Technologies, Inc.
- UNIMICRON TECHNOLOGY CORP.
- NCAB Group AB
- Ibiden Co., Ltd.
- Sierra Circuits, Inc.
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America High-Density Interconnect (HDI) PCB Market, by End User
1.4.2 North America High-Density Interconnect (HDI) PCB Market, by Application
1.4.3 North America High-Density Interconnect (HDI) PCB Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.3 Porter Five Forces Analysis
Chapter 4. North America High-Density Interconnect (HDI) PCB Market by End User
4.1 North America Consumer Electronics Market by Country
4.2 North America Automotive Market by Country
4.3 North America Industrial Electronics Market by Country
4.4 North America IT & Telecommunications Market by Country
4.5 North America Others Market by Country
Chapter 5. North America High-Density Interconnect (HDI) PCB Market by Application
5.1 North America Smartphone & Tablet Market by Country
5.2 North America PC & Laptop Market by Country
5.3 North America Smart Wearables Market by Country
5.4 North America Others Market by Country
Chapter 6. North America High-Density Interconnect (HDI) PCB Market by Country
6.1 US High-Density Interconnect (HDI) PCB Market
6.1.1 US High-Density Interconnect (HDI) PCB Market by End User
6.1.2 US High-Density Interconnect (HDI) PCB Market by Application
6.2 Canada High-Density Interconnect (HDI) PCB Market
6.2.1 Canada High-Density Interconnect (HDI) PCB Market by End User
6.2.2 Canada High-Density Interconnect (HDI) PCB Market by Application
6.3 Mexico High-Density Interconnect (HDI) PCB Market
6.3.1 Mexico High-Density Interconnect (HDI) PCB Market by End User
6.3.2 Mexico High-Density Interconnect (HDI) PCB Market by Application
6.4 Rest of North America High-Density Interconnect (HDI) PCB Market
6.4.1 Rest of North America High-Density Interconnect (HDI) PCB Market by End User
6.4.2 Rest of North America High-Density Interconnect (HDI) PCB Market by Application
Chapter 7. Company Profiles
7.1 MEIKO ELECTRONICS CO., LTD.
7.1.1 Company Overview
7.1.2 SWOT Analysis
7.2 DAP CORPORATION
7.2.1 Company Overview
7.2.2 SWOT Analysis
7.3 Unitech Printed Circuit Board Corp.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expenses
7.3.5 SWOT Analysis
7.4 FICT LIMITED (Fujitsu Limited)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.4.5 SWOT Analysis
7.5 UNIMICRON TECHNOLOGY CORP.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 SWOT Analysis
7.6 NCAB Group AB
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 SWOT Analysis
7.7 Ibiden Co., Ltd.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Sierra Circuits, Inc.
7.8.1 Company Overview
7.8.2 SWOT Analysis
7.9 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.9.5 SWOT Analysis
7.10. TTM Technologies, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 SWOT Analysis
TABLE 1 North America High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 2 North America High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 3 North America High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 4 North America High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 5 North America Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 6 North America Consumer Electronics Market by Country, 2023 - 2030, USD Million
TABLE 7 North America Automotive Market by Country, 2019 - 2022, USD Million
TABLE 8 North America Automotive Market by Country, 2023 - 2030, USD Million
TABLE 9 North America Industrial Electronics Market by Country, 2019 - 2022, USD Million
TABLE 10 North America Industrial Electronics Market by Country, 2023 - 2030, USD Million
TABLE 11 North America IT & Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 12 North America IT & Telecommunications Market by Country, 2023 - 2030, USD Million
TABLE 13 North America Others Market by Country, 2019 - 2022, USD Million
TABLE 14 North America Others Market by Country, 2023 - 2030, USD Million
TABLE 15 North America High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 16 North America High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 17 North America Smartphone & Tablet Market by Country, 2019 - 2022, USD Million
TABLE 18 North America Smartphone & Tablet Market by Country, 2023 - 2030, USD Million
TABLE 19 North America PC & Laptop Market by Country, 2019 - 2022, USD Million
TABLE 20 North America PC & Laptop Market by Country, 2023 - 2030, USD Million
TABLE 21 North America Smart Wearables Market by Country, 2019 - 2022, USD Million
TABLE 22 North America Smart Wearables Market by Country, 2023 - 2030, USD Million
TABLE 23 North America Others Market by Country, 2019 - 2022, USD Million
TABLE 24 North America Others Market by Country, 2023 - 2030, USD Million
TABLE 25 North America High-Density Interconnect (HDI) PCB Market by Country, 2019 - 2022, USD Million
TABLE 26 North America High-Density Interconnect (HDI) PCB Market by Country, 2023 - 2030, USD Million
TABLE 27 US High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 28 US High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 29 US High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 30 US High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 31 US High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 32 US High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 33 Canada High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 34 Canada High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 35 Canada High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 36 Canada High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 37 Canada High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 38 Canada High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 39 Mexico High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 40 Mexico High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 41 Mexico High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 42 Mexico High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 43 Mexico High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 44 Mexico High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 45 Rest of North America High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 46 Rest of North America High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 47 Rest of North America High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 48 Rest of North America High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 49 Rest of North America High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 50 Rest of North America High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 51 Key Information – MEIKO ELECTRONICS CO., LTD.
TABLE 52 Key Information – DAP CORPORATION
TABLE 53 Key Information – Unitech Printed Circuit Board Corp.
TABLE 54 Key Information – FICT LIMITED
TABLE 55 Key Information – UNIMICRON TECHNOLOGY CORP.
TABLE 56 Key Information – NCAB Group AB
TABLE 57 Key Information – Ibiden Co., Ltd.
TABLE 58 Key Information – Sierra Circuits, Inc.
TABLE 59 Key Information – AT&S Group
TABLE 60 Key Information – TTM Technologies, Inc.
List of Figures
FIG 1 Methodology for the research
FIG 2 North America High-Density Interconnect (HDI) PCB Market, 2019 - 2030, USD Million
FIG 3 Key Factors Impacting High-Density Interconnect (HDI) PCB Market
FIG 4 Porter’s Five Forces Analysis – High-Density Interconnect (HDI) PCB Market
FIG 5 North America High-Density Interconnect (HDI) PCB Markets share by End User, 2022
FIG 6 North America High-Density Interconnect (HDI) PCB Market share by End User, 2030
FIG 7 North America High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2030, USD Million
FIG 8 North America High-Density Interconnect (HDI) PCB Market share by Application, 2022
FIG 9 North America High-Density Interconnect (HDI) PCB Market share by Application, 2030
FIG 10 North America High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2030, USD Million
FIG 11 North America High-Density Interconnect (HDI) PCB Market share by Country, 2022
FIG 12 North America High-Density Interconnect (HDI) PCB Market share by Country, 2030
FIG 13 North America High-Density Interconnect (HDI) PCB Market by Country, 2019 - 2030, USD Million
FIG 14 SWOT Analysis: MEIKO ELECTRONICS CO., LTD.
FIG 15 SWOT Analysis: DAP CORPORATION
FIG 16 SWOT Analysis: Unitech Printed Circuit Board Corp.
FIG 17 SWOT Analysis: FICT LIMITED
FIG 18 SWOT Analysis: UNIMICRON TECHNOLOGY CORP.
FIG 19 SWOT Analysis: NCAB Group AB
FIG 20 SWOT Analysis: Ibiden Co., Ltd.
FIG 21 SWOT Analysis: Sierra Circuits, Inc.
FIG 22 SWOT Analysis: AT& S Austria Technologie & Systemtechnik Aktiengesellschaft
FIG 23 SWOT Analysis: TTM Technologies, Inc.