The North America Semiconductor Bonding Market would witness market growth of 3.2% CAGR during the forecast period (2023-2030).
The emergence of innovative technologies, including artificial intelligence, energy-efficient sensing equipment, brain-inspired computing, robotics, and automated machinery, has significantly fueled the market's growth. Additionally, semiconductor bonding is very complex and is used in consumer electronics, computing, communications, aerospace, medical, retail, and aerospace industries.
The market is anticipated to be driven in the near future by the rising use of 3D chip modules. By vertically stacking two or more semiconductors and employing various bonding techniques, including adhesive, soft soldering, and eutectic, 3D ICs are created. In addition to occupying less space, 3D packaging provides superior product performance and reduced energy consumption. Die bonders provide the micro-level accuracy required to produce 3D chip modules, ensuring a smooth bonding process.
The market is anticipated to grow faster due to the expanding use of 3D semiconductor components, increasing Outsourced Semiconductor Assembly and Test (OSAT) company and foundry competition, and increasing demand for MEMS and MOEMS from the automotive industry. RF transmitters and transceivers, vital parts of mobile devices, are made with 3D ICs.
The US government is providing numerous growth prospects for the semiconductor industry. For example, the CHIPS for America initiative funds companies aiming to produce semiconductor chips nationwide. Recently funding announcement by the National Institute of Standards and Technology was expanded till June 2023 to include requests for proposals for facilities that will be used to manufacture semiconductor materials and materials-related equipment, for which the cost of capital will be $300 million or more. With rise in the EV sector along with the North government support for semiconductor chip production, in North America region, the market is estimated to grow in the upcoming years.
The US market dominated the North America Semiconductor Bonding Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $220.8 million by 2030. The Canada market is estimated to witness a CAGR of 5.5% during (2023 - 2030). Additionally, The Mexico market would showcase a CAGR of 4.6% during (2023 - 2030).
Based on Application, the market is segmented into LED, Mems & Sensors, RF Devices, CMOS Image Sensors, and 3D NAND. Based on Type, the market is segmented into Wafer Bonder, Die Bonder, and Flip Chip Bonder. Based on Bonding Technology, the market is segmented into Die Bonding Technology, and Wafer Bonding Technology (Direct & Anodic Wafer Bonding, and Indirect Wafer Bonding). Based on Process Type, the market is segmented into Die To Die Bonding, Wafer To Wafer Bonding, and Die To Wafer Bonding. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Worldwide Semiconductor Bonding Market is Projected to reach USD 1.1 Billion by 2030, at a CAGR of 3.6%
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Mycronic AB, TDK Corporation, EV Group, Panasonic Holdings Corporation, Tokyo Electron Ltd., Mitsubishi Electric Corporation, Intel Corporation, SÜSS MicroTec SE, Fuji Corporation (Fasford Technology Co., Ltd.), Shibuara Mechatronics Corporation
By Application
By Type
By Bonding Technology
By Process Type
By Country
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