Global Power over Ethernet Chipsets Market By Type (PoE Power Sourcing Equipment Chipset, PoE Powered Devices Chipset), Device Type (VoIP Phone, Wireless Radio Access Point, Proximity Sensor, Network Cameras, Ethernet Switch & Injector), Application (Connectivity, LED Lighting, Infotainment, Security), End User (Enterprise - Office Buildings & Small Offices, Hospitality, Retail, Healthcare; Individual)
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The Global Power over Ethernet Chipsets Market size is expected to reach $1.05 billion by 2024, rising at a market growth of 10.5% CAGR during the forecast period. The Power over Ethernet technology would witness rapid growth due to the technological capability to transmit electrical power and networking through one cable.
The use of Power over Ethernet chipsets would significantly reduce the wires used, which would eventually lead to lower costs, simplified infrastructure management, easier maintenance, limited downtime, flexible installation, and minimal power consumption. Based on the type, the Power over Ethernet Chipsets market is segmented into PoE Power Sourcing Equipment Chipset and PoE Powered Devices Chipset.
Based on the device type, the market is segmented into VoIP Phone, Wireless Radio Access Point, Proximity Sensor, Network Cameras, Ethernet Switch & Injector and Others. The Applications highlighted in this report include Connectivity, LED Lighting, Infotainment, Security, and Others. Based on Deployment Type, the market is segmented into Cloud based and On-Premise.
The end users covered under the report include Commercial and Industrial & Residential. The commercial segment is further segmented into Office Buildings & Small Offices, Hospitality, Retail and Healthcare. Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa. The market research report covers the analysis of key stake holders of the market.
Key companies profiled in the report include STMicroelectronics N.V., Silicon Laboratories, Inc., On Semiconductor, Maxim Integrated Products, Inc., Microchip Technology Incorporated, Texas Instruments incorporated, Robert Bosch GmbH, NXP Semiconductor N.V., Microsemi Corporation, and Honeywell International, Inc.