According to a new report, published by KBV research, The Global 3D IC and 2.5D IC Packaging Market size is expected to reach $83 billion by 2029, rising at a market growth of 10.1% CAGR during the forecast period.
The 2.5D segment acquired maximum revenue share in the Global 3D IC and 2.5D IC Packaging Market by Packaging Technology in 2022 thereby, achieving a market value of $42.6 billion by 2029. When devices are bundled together, they take up less room than when they are packaged separately. An interposer arrangement may be as small as a conventional 2D chip, depending on the dimensions and needs of the components. A 2.5D assembly can perform better than a comparable circuit board because shorter distances permit electronic signals to move between components more quickly.
The Automotive segment is showcasing a CAGR of 10.6% during (2023 - 2029). Manufacturers in this sector are quickly adopting cutting-edge technology and parts into their equipment and goods. Additionally, automakers are stepping up their R&D efforts to grow the industry and provide new ideas. Therefore, the need for 3D IC and 2.5D IC packaging would increase due to increased industrial initiatives and R&D activities. This element would fuel this market segment's expansion.
The Memory segment is leading the Global 3D IC and 2.5D IC Packaging Market by Application in 2022 thereby, achieving a market value of $22.8 billion by 2029. One of the primary benefits of 3D IC and 2.5D IC packaging is the ability to increase memory capacity. By stacking multiple memory dies on top of each other or placing them side by side, these technologies enable more memory to be packed into a smaller space. 3D IC and 2.5D IC packaging can also improve the performance of memory devices.
The Asia Pacific market dominated the Global 3D IC and 2.5D IC Packaging Market by Region in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $35.7 billion by 2029. The Europe market is estimated to grow a CAGR of 9.6% during (2023 - 2029). Additionally, The North America market would witness a CAGR of 9.4% during (2023 - 2029).
Full Report: https://www.kbvresearch.com/3d-ic-and-2-point-5d-ic-packaging-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.
By Packaging Technology
By End User
By Application
By Geography
Companies Profiled
Unique Offerings 
