According to a new report, published by KBV research, The Global Embedded Die Packaging Technology Market size is expected to reach $214.1 Million by 2028, rising at a market growth of 18.6% CAGR during the forecast period.
The IT & Telecommunication segment is showcasing a CAGR of 18.8% during (2022 - 2028). The expanding embedded die packaging technology market is fueled by the rising use of embedded die packaging in the healthcare and automotive industries. Compactness, dependability, and increased signal density are just a few of the advantages embedded die packaging technology has over other advanced packaging technologies. These benefits are helping to drive the market for embedded die packaging technology among manufacturing companies.
The Embedded Die in IC Package Substrate segment acquired maximum revenue share in the Global Embedded Die Packaging Technology Market by Platform in 2021 thereby, achieving a market value of $100.7 Million by 2028. When creating the substrate for an IC package, the semiconductor die is implanted within commonly printed circuit board material. The platform has several advantages, including increased mechanical stability, design freedom and downsizing, higher dependability, and improved electrical and thermal performance.
The Asia Pacific market dominated the Global Embedded Die Packaging Technology Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $92.4 Million by 2028. The Europe market is exhibiting a CAGR of 18.4% during (2022 - 2028). Additionally, The North America market would showcase a CAGR of 17.9% during (2022 - 2028).
Full Report: https://www.kbvresearch.com/embedded-die-packaging-technology-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
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