The Worldwide High-Density Interconnect (HDI) PCB Market is Projected to reach USD 26.9 Billion by 2030, at a CAGR of 10.9%

High-Density Interconnect (HDI) PCB Market Growth, Trends and Report Highlights

According to a new report, published by KBV research, The Global High-Density Interconnect (HDI) PCB Market size is expected to reach $26.9 billion by 2030, rising at a market growth of 10.9% CAGR during the forecast period.

The Consumer Electronics segment is leading the Global High-Density Interconnect (HDI) PCB Market by End User in 2022; thereby, achieving a market value of $11 billion by 2030. Computers used to occupy entire rooms, but due in part to HDI technology, today's gadgets as small as smartwatches are effectively personal computers on a smaller scale. Currently, HDI PCB boards are used in a variety of consumer electronics, including computers, cellphones, wearables, and other consumer electronics such as GPS systems and digital cameras.

The Smart Wearables segment is experiencing a CAGR of 12.2% during (2023 - 2030). The high component density is made feasible by the technological properties of HDI PCBs, which have extraordinarily high-density routing linkages. Due to their great performance and lightweight, HDI boards are perfect for supplying power to wearable technology. Numerous tools for tracking fitness and health are available with smart wearables like fitness trackers and smartwatches.

The Asia Pacific region dominated the Global High-Density Interconnect (HDI) PCB Market by Region in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $10.6 billion by 2030. The Europe market poised to grow at a CAGR of 10.4% during (2023 - 2030). Additionally, The North America market would witness a CAGR of 10.2% during (2023 - 2030).

Full Report: https://www.kbvresearch.com/high-density-interconnect-pcb-market/

The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.

Global High-Density Interconnect (HDI) PCB Market Segmentation

By End User

• Consumer Electronics
• Automotive
• Industrial Electronics
• IT & Telecommunications
• Others

By Application

• Smartphone & Tablet
• PC & Laptop
• Smart Wearables
• Others

By Geography

• North America
  • US
  • Canada
  • Mexico
  • Rest of North America
• Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
• LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Companies Profiled

• MEIKO ELECTRONICS CO., LTD.
• DAP CORPORATION
• AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
• Unitech Printed Circuit Board Corp.
• FICT LIMITED (Fujitsu Limited)
• TTM Technologies, Inc.
• UNIMICRON TECHNOLOGY CORP.
• NCAB Group AB
• Ibiden Co., Ltd.
• Sierra Circuits, Inc.

Related Reports:

North America High-Density Interconnect (HDI) PCB Market Size, 2030

• July-2023
• 101 Pages

LAMEA High-Density Interconnect (HDI) PCB Market Size, 2030

• July-2023
• 109 Pages

Europe High-Density Interconnect (HDI) PCB Market Size, 2030

• July-2023
• 108 Pages

Asia Pacific High-Density Interconnect (HDI) PCB Market Size, 2030

• July-2023
• 109 Pages