The Multilayer Printed Circuit Board Market is Predict to reach USD 99.11 Billion by 2031, at a CAGR of 5.2%

07-Feb-2025 | Report Format: Electronic (PDF)

Multilayer Printed Circuit Board Market Growth, Trends and Report Highlights

According to a new report, published by KBV research, The Global Multilayer Printed Circuit Board Market size is expected to reach $99.11 billion by 2031, rising at a market growth of 5.2% CAGR during the forecast period.

The Layer 6 & Above segment exhibits a CAGR of 5.7% during (2024 - 2031). These PCBs are essential for applications demanding superior signal integrity, high-speed data transmission, and efficient thermal management, such as telecommunications, aerospace, and medical equipment. The rollout of 5G technology has been a major growth driver, as it requires complex PCBs to handle high-frequency signals. Additionally, the increasing reliance on sophisticated electronics in healthcare, including diagnostic and monitoring devices, fuels the demand for this segment.

Multilayer Printed Circuit Board Market Size - By Region

The Rigid segment is leading the Global Multilayer Printed Circuit Board Market by Substrate in 2023; thereby, achieving a market value of $63.94 billion by 2031. These PCBs are ideal for applications requiring durability and structural stability, such as consumer electronics, automotive systems, and industrial machinery. Their ability to support complex multilayer configurations while maintaining reliability makes them preferred for devices like computers, televisions, and gaming consoles. Additionally, rigid PCBs' long lifespan and consistent performance have made them a staple in applications where cost efficiency and dependability are critical.

The Industrial Electronics segment is experiencing a CAGR of 4.4% during (2024 - 2031). The segment benefits from the rising adoption of automation, robotics, and Industrial Internet of Things (IIoT) technologies in manufacturing and processing industries. Multilayer PCBs are integral to operating industrial equipment such as control systems, sensors, and monitoring devices, ensuring reliability and high performance in demanding environments. The transition to smart factories and Industry 4.0 initiatives has amplified the need for advanced PCBs to enable seamless communication and data processing in industrial settings. The growing emphasis on operational efficiency and predictive maintenance further drives demand in this segment.

Full Report: https://www.kbvresearch.com/multilayer-printed-circuit-board-market/

The Asia Pacific region dominated the Global Multilayer Printed Circuit Board Market by Region in 2023; thereby, achieving a market value of $38.66 billion by 2031. The North America region is registering a CAGR of 4.5% during (2024 - 2031). Additionally, The Europe region would expected to witness a CAGR of 4.8% during (2024 - 2031).

List of Key Companies Profiled

  • TTM Technologies, Inc.
  • Fujikura Ltd.
  • Flex Ltd.
  • Jabil, Inc.
  • Plexus Corporation
  • Benchmark Electronics, Inc.
  • Creation Technologies LP
  • Sierra Circuits, Inc. 
  • Epec LLC
  • Molex, LLC (Koch Industries, Inc.)

Multilayer Printed Circuit Board Market Report Segmentation

By Layer

  • Layer 4 to 6
  • Layer 6 & Above

By Substrate

  • Rigid
  • Flexible
  • Rigid-Flex

By End Use Industry

  • Consumer Electronics
  • Industrial Electronics
  • IT & Telecom
  • Automotive
  • Healthcare
  • Aerospace & Defense
  • Other End Use Industry

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Call: +1(646) 600-5072

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