The Next Generation Non-Volatile Memory Market is Predict to reach USD 18.6 Billion by 2031, at a CAGR of 17.3%

09-Sep-2024 | Report Format: Electronic (PDF)

Next Generation Non-Volatile Memory Market Growth, Trends and Report Highlights

According to a new report, published by KBV research, The Global Next Generation Non-Volatile Memory Market size is expected to reach $18.6 billion by 2031, rising at a market growth of 17.3% CAGR during the forecast period.

The Hybrid Memory Cube (HMC) segment is exhibiting a CAGR of 17.8% during (2024 - 2031). HMC addresses the limitations of traditional memory architectures by significantly reducing memory bottlenecks. In next generation NVM applications, where data throughput is critical, HMC’s ability to handle massive data flows without the bottlenecks associated with conventional DRAM enhances system performance and efficiency.

Next Generation Non-Volatile Memory Market Size - By Region

The 300 mm segment is leading the Global Next Generation Non-Volatile Memory Market by Wafer Size in 2023; thereby, achieving a market value of $10.9 billion by 2031.  300 mm wafers offer greater surface area which allows for the production of more chips per wafer. This increased yield per wafer leads to more efficient manufacturing processes, reducing the cost per chip and meeting the high demand for next generation NVM technologies. Using 300 mm wafers helps lower the cost of producing memory chips.

The Information Technology segment would showcase a CAGR of 16.9% during (2024 - 2031). Modern IT applications, including databases, data warehousing, and real-time analytics, require rapid access to data. Next generation NVM provides low latency and high-speed data access, which is crucial for enhancing the performance of these applications and meeting the demands of high-speed computing environments. As IT systems evolve, there is a growing need for storage solutions that offer superior performance compared to traditional memory.

Full Report: https://www.kbvresearch.com/next-generation-non-volatile-memory-market/

The Asia Pacific region dominated the Global Next Generation Non-Volatile Memory Market by Region in 2023; thereby, achieving a market value of $7.5 billion by 2031. The North America region is poised to grow at a CAGR of 16.6% during (2024 - 2031). Additionally, The Europe region would witness a CAGR of 16.8% during (2024 - 2031).

List of Key Companies Profiled

  • Samsung Electronics Co. Ltd
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Intel Corporation
  • Kingston Technology Company, Inc.
  • Kioxia Holdings Corporation

Next Generation Non-Volatile Memory Market Report Segmentation

By Type

  • High-bandwidth Memory (HBM)
  • Hybrid Memory Cube (HMC)

By Wafer Size

  • 300 mm
  • 200 mm

By Application

  • BFSI
  • Information Technology
  • Consumer Electronics
  • Telecommunications
  • Government
  • Others

By Geography

  • North America
    • US
    • Canada
    • Mexico
    • Rest of North America
  • Europe
    • Germany
    • UK
    • France
    • Russia
    • Spain
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Singapore
    • Taiwan
    • Rest of Asia Pacific
  • LAMEA
    • Brazil
    • Argentina
    • UAE
    • Saudi Arabia
    • South Africa
    • Nigeria
    • Rest of LAMEA

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