According to a new report, published by KBV research, The Global Radiation Hardened Electronics Market size is expected to reach $1.8 billion by 2028, rising at a market growth of 3.9% CAGR during the forecast period.
The Power Management segment acquired maximum revenue share in the Global Radiation Hardened Electronics Market by Component in 2021, thereby, achieving a market value of $776 million by 2028. A power device is an integral part of every electronic system because it controls its entire operation. Space applications require power management technologies that are highly resistant to ionizing radiation and high-energy charged particles. In terms of reduced losses and enhanced functionality, technological advances are assisting in the evolution of power devices.
The Radiation-Hardening by Process (RHBP) segment is showcasing a CAGR of 6.3% during (2022 - 2028). It is because rad-hard-by-process (RHBP) radiation-hardening approach uses changed production processes to improve the ability to tolerate radiation. The expense of building new RHBP technology nodes has become unacceptably expensive as transistors' feature sizes continue to drop. As a result, no RHBP technologies which are only one or two stages behind state-of-the-art 22-nm commercialized technologies are available today.
The Commercial-off-the-Shelf (COTS) segment is leading the Global Radiation Hardened Electronics Market by Product Type in 2021, thereby, achieving a market value of $1.43 billion by 2028. When compared to space-grade counterparts, commercial-off-the-shelf (COTS) electronics provide cutting-edge functionality at cheaper prices. However, due to concerns about survivability in a space environment, usage in space missions has been limited. COTS devices are not designed to withstand the severe radiation environment of space. COTS electronics may, nevertheless, be a viable option for short-duration space missions.
The Aerospace & Defense market has shown growth rate of 3.2% during (2022 - 2028). It is because the radiation is one of the most harmful forces known to exist in deployed aerospace and defense electronics systems. This force can exist naturally in orbit and at high elevations on Earth, or it can be unleashed in large amounts when nuclear bombs are detonated. Engineers designing for radiation settings must employ radiation-hardened electronic components in either case.
The North America market dominated the Global Radiation Hardened Electronics Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $768.3 million by 2028. The Europe market is estimated to grow at a CAGR of 3.5% during (2022 - 2028). Additionally, The Asia Pacific market would witness a CAGR of 4.8% during (2022 - 2028).
Full Report: https://www.kbvresearch.com/radiation-hardened-electronics-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Renesas Electronics Corporation, STMicroelectronics N.V., Infineon Technologies AG, Texas Instruments, Inc., Microchip Technology, Inc., Teledyne Technologies, Inc., Honeywell International, Inc., BAE Systems PLC, Xilinx, Inc., and TTM Technologies, Inc.
By Component
By Manufacturing Technique
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By Geography
Companies Profiled
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