According to a new report, published by KBV research, The Global Thin Wafer Market size is expected to reach $22.2 billion by 2028, rising at a market growth of 13.0% CAGR during the forecast period.
The 200 mm market is showcasing a CAGR of 13.6% during (2022 - 2028). It is because market leaders in power devices like Metal-Oxide-Semiconductor Insulated-Gate Bipolar Transistor (IGBT), Field-Effect Transistor (MOSFET), and Radio Frequency (RF) devices are increasingly adopting 200 mm wafers. The wafer sector is preparing several strategic measures to meet the rising demand.
The Dicing market acquired the high revenue share in the Global Thin Wafer Market by Technology in 2021, thereby, achieving a market value of $9.8 billion by 2028. Ultra-thin wafer dicing is necessary because of ongoing package downsizing and memory capacity growth. The use of RFID tags and SIP (system in package) for cellphones and other small electrical devices has grown in recent years. As a result, the number of finished semiconductors dies with a thickness of less than or equal to 100 m has grown quickly.
The MEMS market shows the high growth rate of 13.4% during (2022 - 2028). Micro-Electro-Mechanical Systems, or MEMS, are a technology that, in their broadest sense, can be characterized as miniature mechanical and electro-mechanical components (i.e., devices and structures), and created utilizing microfabrication processes.
The Asia Pacific market dominated the Global Thin Wafer Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $8.2 billion by 2028. The Europe market is anticipated to grow at a CAGR of 12.6% during (2022 - 2028). Additionally, The North America market would witness a CAGR of 12.4% during (2022 - 2028).
Full Report: https://www.kbvresearch.com/thin-wafer-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.
By Wafer Size
By Technology
By Application
By Geography
Companies Profiled
Unique Offerings 
