According to a new report, published by KBV research, The Global Wafer Level Packaging Market size is expected to reach $14.1 billion by 2028, rising at a market growth of 17.7% CAGR during the forecast period.
The Automotive segment is showcasing a CAGR of 19% during (2022 - 2028). Manufacturers in the automotive industry are rapidly incorporating innovative technology and components into their machines and products. In addition, car manufacturers are increasing their R&D activities in order to bring more innovations and advancements to the sector. Therefore, due to increasing efforts and R&D activities in the industry, the demand for wafer level packaging would surge. This factor would drive the growth of this segment.
The WLCSP segment acquired maximum revenue share in the Global Wafer Level Packaging Market by Type in 2021, thereby, achieving a market value of $5.3 billion by 2028. The growth of this segment is attributed to the fact that this technology is a variant of the traditional flip-chip interconnection technology, in which, all the packaging is done at wafer level. Moreover, it is a true scale packaging technology, due to which, it is widely being employed.
The Fan OUT segment has shown growth rate of 18.3% during (2022 - 2028). Fan-out wafer-level packaging, also known as FOWL packaging, wafer-level fan-out packaging, fan-out WLP, FO-WLP, FOWLP, is a wafer-level packaging (WLP) technology that improves on typical WLP solutions. A wafer is diced first, then individual dies are packaged in traditional technologies. The package size is usually much bigger than the die size. Integrated circuits are packaged while still on the wafer in conventional WLP processes, and the wafer, with outer layers of packaging already attached, is diced later. The final package is about the same size as the die itself.
The Asia Pacific is the fastest growing region in the Global Wafer Level Packaging Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $5.7 billion by 2028. The Europe market is estimated to witness a CAGR of 16.9% during (2022 - 2028). Additionally, The North America market would experience a CAGR of 16.7% during (2022 - 2028).
Full Report: https://www.kbvresearch.com/wafer-level-packaging-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
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