The Global Silicon on Insulator (SOI) Market size is expected to reach $3.5 billion by 2028, rising at a market growth of 16.7% CAGR during the forecast period.
Silicon on Insulator (SOI) is a semiconductor device or a microchip manufacturing technique in which thin films of single crystalline silicon are placed on an insulator’s top to smoothen the integrated circuits (IC) fabrication. This can help minimize the power usage while reducing the junction capacitance, which enables high speed, optimizing the SOI-based device’s performance and eliminating the charge leakage.
Due to these properties, they are broadly used for creating various consumer electronics, microelectromechanical systems (MEMS), radio frequency (RF) signal processors, microprocessors, and biotechnological chips. It is commercially offered in partial or depleted silicon on insulator types.
Devices with SOI are different from the traditionally built devices, where the silicon junction is on top of an electrical insulator, usually silicon dioxide or sapphire. These devices are known as silicon on sapphire or SOS. The choice of insulator generally depends on the required applications; for instance, with sapphire, high-performance radio frequency (RF) and radiation-sensitive applications are used, silicon dioxide for diminished short channel effects in other microelectronics devices.
The topmost silicon layer and insulating layer also differ widely with the application. SOI technology is one of the many manufacturing strategies which enables the continued miniaturizations of microelectronic devices, colloquially referred to as “extending Moore’s Law” (or “More Moore,” abbreviated “MM”).
The pandemic is also expected to increase the adoption and automation of Industry 4.0 technologies. Maintenance, remote manufacturing, and diagnostics could all become permanent features. Companies dealing in semiconductors might become innovative workspaces with technologies that enable most employees to work remotely. Companies are also expected to adopt and promote a hybrid model in their manufacturing processes in which a certain number of workers operate remotely from the site and the rest. The efficiency obtained through such changes combined with the start-up costs can influence the future revenues of silicon on insulators. As a result, the silicon on insulator market has benefited from the COVID-19.
The usage of digital gadgets has been increasing across the globe for the past few years. This is due to the rising internet penetration and increased affordability of consumers in low-and middle-income countries. With the advent of such gadgets, the demand for semiconductor devices such as SOI is predicted to rise. Owing to all these elements, the market for silicon on insulator is expected to grow at a steady pace.
The SOI technology ensures extremely low current leakage, dense and small packaging, low power consumption, and cost efficiency of IoT devices, which is why its usage creates opportunities for new IoT devices and applications in digital electronics. Devices based on the FD SOI wafers have reverse bias characteristics, which help them function at low voltages without loss of performance or cost, thus making them the most effective techniques used in IoT devices. The increasing deployment of FD-SOI-based IoT solutions in network infrastructure and automotive applications is expected to give opportunities for the SOI market’s growth.
Various disadvantages are linked with the SOI, for instance, floating body, reduced breakdown voltage, and self-heating effects in devices based on SOI wafers. Reduced breakdown voltage levels severely limit the maximum supply voltage at which the SOI wafer-based circuit and devices can operate. In addition, the SOI wafer-based transistor cannot be switched off by changing the gate bias when the parasitic device is turned on. In SOI wafer-based devices, a floating body is the body terminal either left free for floating or tied to the gate. Due to these drawbacks of the SOI wafer-based devices, the adoption of SOI wafers-based devices may decline, thereby hindering market growth.
By wafer size, the silicon on insulator market is classified into 200 mm & less than 200 mm and 300 mm. The 300 mm segment garnered the highest revenue share in the silicon on insulator market in 2021. Because of the radio frequency, manufacturing companies are undertaking various initiatives to raise their production of 300 mm wafers. In addition, many wafer players are increasing their production to meet the increasing need, and many foundries in multiple nations are expanding their RF-SOI manufacturing processes for 300 mm wafers, aiding the segment’s expansion during the projected period.
Based on the wafer type, the silicon on insulator market is segmented into RF SOI, FD SOI, PD SOI, power SOI and emerging SOI. The FD SOI segment recorded a remarkable growth rate in the silicon on insulator market in 2021. Due to their advantages like low cost, reduced leakage current, less complexity, high flexibility, and their ability to enhance performance and power trade-offs. Various FD SOI wafer manufacturers are leaning towards new product launches and collaborations with other SOI market players to meet the increasing demand and strengthen their product portfolio. Thus, propelling the market segment’s growth.
On the basis of technology, the silicon on insulator market is bifurcated into smart cut, bonding SOI and layer transfer SOI. The bonding SOI segment registered a considerable growth rate in the silicon on insulator market in 2021. The main applications of bonding are usually in the areas of SOI devices and silicon-based actuators and sensors. The top layer of the bonded SOI structures comprises a single-crystal silicon, a layer of silicon dioxide (SiO2) known as buried oxide, and a silicon substrate handle that works as machinal support.
By product, the silicon on insulator market is divided into RF FEM products, MEMS devices, power products, optical communication and image sensing. The image sensing segment recorded a promising growth rate in the silicon on insulator market in 2021. The growth is result of the fabrication of the SOI complementary metal oxide semiconductor (CMOS) active pixel imaging sensors with a pinned photodiode on the handle wafer. The layout of the one-pixel is a four-transistor type active pixel image sensor, which includes a reset and a source follower transistor on a seed wafer.
Based on the application, the silicon on insulator market is divided into consumer electronics, automotive, datacom & telecom, industrial and military, defense & aerospace. The military, defense & aerospace segment recorded a promising growth rate in the silicon on insulator market in 2021. This is due to the benefits like low leakage current to substrate, which enables highly improved circuit operations to constant 225 C and excursions to 300. In addition, it reduces capacitance for lower and faster power circuits while significantly decreasing noise with isolation from the bulk silicon for sensitive mixed-signal circuits. Benefits like this will help in the market segment’s growth.
| Report Attribute | Details |
|---|---|
| Market size value in 2021 | USD 1.2 Billion |
| Market size forecast in 2028 | USD 3.5 Billion |
| Base Year | 2021 |
| Historical Period | 2018 to 2020 |
| Forecast Period | 2022 to 2028 |
| Revenue Growth Rate | CAGR of 16.7% from 2022 to 2028 |
| Number of Pages | 339 |
| Number of Tables | 590 |
| Report coverage | Market Trends, Revenue Estimation and Forecast, Segmentation Analysis, Regional and Country Breakdown, Companies Strategic Developments, Company Profiling |
| Segments covered | Wafer Size, Wafer Type, Application, Technology, Product, Region |
| Country scope | US, Canada, Mexico, Germany, UK, France, Russia, Spain, Italy, China, Japan, India, South Korea, Singapore, Malaysia, Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria |
| Growth Drivers |
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| Restraints |
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Region-wise, the silicon on insulator market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific region procured the highest revenue share in the silicon on insulator market in 2021. The growth in this region is attributable from the rising demand for consumer electronics like smartphones, tablets, smart wearables, and laptops. In addition, the telecom sector is anticipated to provide improved opportunities for the region's market.
Free Valuable Insights: Global Silicon on Insulator (SOI) Market size to reach USD 3.5 Billion by 2028
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.
By Wafer Size
By Wafer Type
By Application
By Technology
By Product
By Geography
The global Silicon on Insulator (SOI) Market size is expected to reach $3.5 billion by 2028.
Rising Usage of Smart Gadgets Such as Smartphones and Tablets are driving the market in coming years, however, Difficulties with SOI Wafers-Based Devices restraints the growth of the market.
Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.
The RF SOI segment acquired maximum revenue share in the Global Silicon on Insulator (SOI) Market by Wafer Type in 2021 thereby, achieving a market value of $1.1 billion by 2028.
The Smart Cut segment is leading the Global Silicon on Insulator (SOI) Market by Technology in 2021 thereby, achieving a market value of $1.8 billion by 2028.
The Asia Pacific market dominated the Global Silicon on Insulator (SOI) Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $1.3 billion by 2028.
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